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1. (WO2019066225) CONDUCTIVE ADHESIVE FILM HAVING EXCELLENT HEAT RESISTANCE AND MOISTURE RESISTANCE
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/066225 International Application No.: PCT/KR2018/008106
Publication Date: 04.04.2019 International Filing Date: 18.07.2018
IPC:
C09J 9/02 (2006.01) ,C09J 7/20 (2018.01) ,C09J 177/00 (2006.01) ,C09J 11/04 (2006.01)
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
9
Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
02
Electrically-conducting adhesives
[IPC code unknown for C09J 7/20]
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
177
Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
02
Non-macromolecular additives
04
inorganic
Applicants:
주식회사 제이에이치씨 JHC CO.LTD [KR/KR]; 충청남도 아산시 배방읍 호서로79번길 20,313호 313-ho, 20, Hoseo-ro 79beon-gil, Baebang-eup Asan-si Chungcheongnam-do 31499, KR
Inventors:
김병선 KIM, Byung Sun; KR
Agent:
강형석 KANG, Hyeong Seok; KR
Priority Data:
10-2017-012474127.09.2017KR
Title (EN) CONDUCTIVE ADHESIVE FILM HAVING EXCELLENT HEAT RESISTANCE AND MOISTURE RESISTANCE
(FR) FILM ADHÉSIF CONDUCTEUR PRÉSENTANT UNE REMARQUABLE RÉSISTANCE À LA CHALEUR ET UNE REMARQUABLE RÉSISTANCE À L'HUMIDITÉ
(KO) 내열성 및 내습성이 우수한 전도성 접착 필름
Abstract:
(EN) The present invention relates to a conductive adhesive film having excellent heat resistance and moisture resistance, and has an adhesive layer, which is made of a conductive adhesive composition comprising 100 parts by weight of a polyamide resin represented by chemical formula 1, 100-400 parts by weight of a conductive metal and 0.1-5 parts by weight of a siloxane compound, and is layered on the surface of a substrate, thereby improving the heat resistance of an adhesive film, facilitates curing with the siloxane compound, thereby improving moisture resistance, and has improved long-term reliability of the heat resistance and moisture resistance.
(FR) La présente invention concerne un film adhésif conducteur présentant une remarquable résistance à la chaleur et une remarquable résistance à l'humidité, et possédant une couche adhésive, qui est constituée d'une composition adhésive conductrice comprenant 100 parties en poids d'une résine de polyamide représentée par la formule chimique 1, 100 à 400 parties en poids d'un métal conducteur et 0,1 à 5 parties en poids d'un composé siloxane, et dont une couche est déposée sur la surface d'un substrat, ce qui permet d'améliorer la résistance à la chaleur d'un film adhésif, facilite le durcissement grâce au composé siloxane, améliorant ainsi la résistance à l'humidité. La fiabilité à long terme de la résistance à la chaleur et de la résistance à l'humidité est, en outre, améliorée.
(KO) 본 발명은 내열성 및 내습성이 우수한 전도성 접착 필름으로서, 화학식 1로 표시되는 폴리아미드 수지 100 중량부; 전도성 금속 100 내지 400 중량부; 실록산 화합물 0.1 내지 5 중량부;를 포함하는 전도성 접착제 조성물로 이루어진 접착층이 기재의 표면에 적층되어 접착 필름의 내열성을 향상시키며 실록산 화합물과의 경화 작용이 용이하여 내습성이 향상되되 상기 내열성 및 내습성에 대한 장기 신뢰성이 향상된 접착 필름에 관한 것이다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)