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1. (WO2019066176) ELECTRONIC DEVICE
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Pub. No.: WO/2019/066176 International Application No.: PCT/KR2018/004030
Publication Date: 04.04.2019 International Filing Date: 05.04.2018
IPC:
H04M 1/02 (2006.01) ,H04Q 9/04 (2006.01) ,H04Q 1/24 (2006.01)
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
M
TELEPHONIC COMMUNICATION
1
Substation equipment, e.g. for use by subscribers
02
Constructional features of telephone sets
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
Q
SELECTING
9
Arrangements in telecontrol or telemetry systems for selectively calling a substation from a main station, in which substation desired apparatus is selected for applying a control signal thereto or for obtaining measured values therefrom
04
Arrangements for synchronous operation
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
Q
SELECTING
1
Details of selecting apparatus or arrangements
18
Electrical details
20
Testing circuits or apparatus; Circuits or apparatus for detecting, indicating, or signalling faults or troubles
22
Automatic arrangements
24
for connection devices
Applicants:
엘지전자 주식회사 LG ELECTRONICS INC. [KR/KR]; 서울시 영등포구 여의대로 128 128, Yeoui-daero Yeongdeungpo-gu Seoul 07336, KR
Inventors:
우승민 WOO, Seungmin; KR
Agent:
박장원 PARK, Jang-Won; KR
Priority Data:
10-2018-002071221.02.2018KR
62/564,22227.09.2017US
Title (EN) ELECTRONIC DEVICE
(FR) DISPOSITIF ÉLECTRONIQUE
(KO) 전자 장치
Abstract:
(EN) The present invention relates to an electronic device comprising: a circuit board installed inside the body of the electronic device and formed by alternately laminating conductive layers made of a conductive material and dielectric layers made of an insulative material; at least one patch antenna arranged on the circuit board; a core layer positioned at the center portion inside the circuit board and made of one of the dielectric layers; a ground layer arranged on the lower portion of the core layer; and an EGB structure positioned inside the circuit board and shaped such that the upper and lower portions thereof are symmetric with each other with reference to the core layer, wherein the EGB structure can limit interference between operating frequency signals emitted from respective patch antennas.
(FR) La présente invention concerne un dispositif électronique comprenant : une carte de circuit imprimé installée à l'intérieur du corps du dispositif électronique et formée par stratification en alternance de couches conductrices constituées d'un matériau conducteur et de couches diélectriques constituées d'un matériau isolant ; au moins une antenne à plaque agencée sur la carte de circuit imprimé ; une couche centrale positionnée au niveau de la partie centrale à l'intérieur de la carte de circuit imprimé et constituée d'une des couches diélectriques ; une couche de masse agencée sur la partie inférieure de la couche centrale ; et une structure EGB positionnée à l'intérieur de la carte de circuit imprimé et formée de sorte que les parties supérieure et inférieure de celle-ci soient symétriques l'une par rapport à l'autre par rapport à la couche centrale, la structure EGB pouvant limiter les interférences entre des signaux de fréquence de fonctionnement émis par des antennes à plaque respectives.
(KO) 본 발명은, 전자 장치에 관한 것으로, 전자 장치의 본체 내부에 설치되는 전도성 물질로 이루어지는 도전층과, 절연 물질로 이루어지는 유전층이 교번적으로 적층 형성되는 회로기판; 상기 회로기판에 배치되는 적어도 하나 이상의 패치 안테나; 회로기판의 내부에 중심부에 위치되고, 상기 유전층 중 어느 하나의 층으로 이루어지는 코어층; 상기 코어층의 하부에 배치되는 그라운드층; 및 상기 코어층을 기준으로 상부와 하부에서 대칭되는 형상으로 상기 회로기판 내부에 위치되는 EBG 구조체를 포함하며, 상기 EBG 구조체는, 상기 각 패치 안테나로부터 방사되는 동작 주파수 신호가 서로 간섭되는 것을 제한할 수 있는 특징이 있다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)