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1. (WO2019066081) COMPOSITE PARTICLES AND MANUFACTURING METHOD THEREFOR, COMPOSITE PARTICLE COMPOSITION, JOINING MATERIAL, JOINING METHOD, AND JOINT BODY
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Pub. No.: WO/2019/066081 International Application No.: PCT/JP2018/036613
Publication Date: 04.04.2019 International Filing Date: 29.09.2018
IPC:
B22F 1/02 (2006.01) ,B22F 1/00 (2006.01) ,B22F 7/08 (2006.01) ,H01L 21/52 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
22
CASTING; POWDER METALLURGY
F
WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
1
Special treatment of metallic powder, e.g. to facilitate working, to improve properties; Metallic powders per se, e.g. mixtures of particles of different composition
02
comprising coating of the powder
B PERFORMING OPERATIONS; TRANSPORTING
22
CASTING; POWDER METALLURGY
F
WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
1
Special treatment of metallic powder, e.g. to facilitate working, to improve properties; Metallic powders per se, e.g. mixtures of particles of different composition
B PERFORMING OPERATIONS; TRANSPORTING
22
CASTING; POWDER METALLURGY
F
WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
7
Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting
06
of composite workpieces or articles from parts, e.g. to form tipped tools
08
with one or more parts not made from powder
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
52
Mounting semiconductor bodies in containers
Applicants:
日鉄ケミカル&マテリアル株式会社 NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. [JP/JP]; 東京都千代田区外神田四丁目14番1号 14-1, Sotokanda 4-chome, Chiyoda-ku, Tokyo 1010021, JP
Inventors:
岡村 一人 OKAMURA Kazuto; JP
清水 隆之 SHIMIZU Takayuki; JP
千葉 将之 CHIBA Masayuki; JP
宇野 智裕 UNO Tomohiro; JP
Agent:
渡邊 和浩 WATANABE Kazuhiro; JP
Priority Data:
2017-19199429.09.2017JP
2017-25477828.12.2017JP
Title (EN) COMPOSITE PARTICLES AND MANUFACTURING METHOD THEREFOR, COMPOSITE PARTICLE COMPOSITION, JOINING MATERIAL, JOINING METHOD, AND JOINT BODY
(FR) PARTICULES COMPOSITES ET LEUR PROCÉDÉ DE FABRICATION, COMPOSITION DE PARTICULES COMPOSITES, MATÉRIAU DE JONCTION, PROCÉDÉ DE JONCTION ET CORPS D'ARTICULATION
(JA) 複合体粒子及びその製造方法、複合体粒子組成物、接合材及び接合方法、並びに接合体
Abstract:
(EN) This composite particle manufacturing method comprises: step A) for mixing a metal salt and a reducing agent so as to prepare a metal complex reaction solution; and step B) for reducing metal ions in said metal complex reaction solution by heating the metal complex reaction solution so as to prepare a slurry of composite particles, wherein metal particles or metal oxide particles having an average particle size of 0.03-50 μm and an organic metal compound selected from alkali metal-based organic metal compounds or alkali earth metal-based organic metal compounds are added at some point in time from step A) until the heating of the metal complex reaction solution in step B).
(FR) Procédé de fabrication de particules composites comprend : l'étape A) consistant à mélanger un sel métallique et un agent réducteur de façon à préparer une solution de réaction complexe métallique; et l'étape B) consistant à réduire des ions métalliques dans ladite solution de réaction de complexe métallique par le chauffage de la solution de réaction de complexe métallique de façon à préparer une suspension de particules composites, des particules métalliques ou particules d'oxyde métallique ayant une taille de particule moyenne de 0,03 à 50 µm et un composé métallique organique choisi parmi des composés métalliques organiques à base de métal alcalin ou des composés métalliques organiques à base de métal alcalino-terreux étant ajoutés à un certain moment à partir de l'étape A) jusqu'au chauffage de la solution de réaction complexe métallique à l'étape B).
(JA) 複合体粒子の製造方法は、工程A)金属塩及び還元剤を混合して金属錯化反応液を得る工程、及び工程B)前記金属錯化反応液を加熱して、該金属錯化反応液中の金属イオンを還元し、複合体粒子のスラリーを得る工程、を含み、前記工程Aから、前記工程Bにおいて前記金属錯化反応液を加熱するまでの間のいずれかのタイミングで、平均粒子径が0.03~50μmの金属粒子又は金属酸化物粒子、及び、アルカリ金属系有機金属化合物又はアルカリ土類金属系有機金属化合物から選ばれる有機金属化合物を添加する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)