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1. (WO2019066060) ADHESIVE COMPOSITION AND ADHESIVE TAPE
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Pub. No.: WO/2019/066060 International Application No.: PCT/JP2018/036541
Publication Date: 04.04.2019 International Filing Date: 28.09.2018
IPC:
C09J 133/06 (2006.01) ,C09J 11/06 (2006.01) ,C09J 11/08 (2006.01) ,C09J 133/02 (2006.01) ,C09J 175/04 (2006.01)
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
133
Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
04
Homopolymers or copolymers of esters
06
of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
02
Non-macromolecular additives
06
organic
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
08
Macromolecular additives
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
133
Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
02
Homopolymers or copolymers of acids; Metal or ammonium salts thereof
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
175
Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
04
Polyurethanes
Applicants:
積水化学工業株式会社 SEKISUI CHEMICAL CO., LTD. [JP/JP]; 大阪府大阪市北区西天満2丁目4番4号 4-4, Nishitemma 2-chome, Kita-ku, Osaka-shi, Osaka 5308565, JP
Inventors:
肥田 知浩 HIDA, Tomohiro; JP
中谷 好孝 NAKATANI, Yoshitaka; JP
高橋 克典 TAKAHASHI, Katsunori; JP
Agent:
田口 昌浩 TAGUCHI, Masahiro; JP
虎山 滋郎 TORAYAMA, Jiro; JP
Priority Data:
2017-18913528.09.2017JP
2017-21782410.11.2017JP
Title (EN) ADHESIVE COMPOSITION AND ADHESIVE TAPE
(FR) COMPOSITION ADHÉSIVE ET RUBAN ADHÉSIF
(JA) 粘着剤組成物、及び粘着テープ
Abstract:
(EN) This adhesive composition contains: 100 parts by mass of an acrylic polymer (X) that has a weight average molecular weight of from 550,000 to 1,000,000; from 3 to 9 parts by mass of a tackifying resin (Y) that has a softening point of from 140°C to 160°C; and a crosslinking agent (Z). The acrylic polymer (X) is a polymer of a monomer component that contains: 100 parts by mass of an alkyl (meth)acrylate ester monomer (A) which contains 60% by mass or more of an alkyl (meth)acrylate ester monomer (a) wherein an alkyl group has 4 or less carbon atoms; and from 5 to 18 parts by mass of a carboxyl group-containing monomer (B). The present invention is able to provide: an adhesive composition which exhibits high adhesion to a slightly bondable adherend such as a polypropylene resin, while being suppressed in decrease of adhesion over time with respect to a soft polyvinyl chloride resin; and an adhesive tape which uses this adhesive composition.
(FR) L'invention concerne une composition adhésive qui contient : 100 parties en masse d'un polymère acrylique (X) qui a une masse moléculaire moyenne en poids de 550 000 à 1 000 000 ; de 3 à 9 parties en masse d'une résine donnant du collant (Y) qui a un point de ramollissement de 140°C à 160°C ; et un agent de réticulation (Z). Le polymère acrylique (X) est un polymère d'un constituant monomère qui contient : 100 parties en masse d'un monomère ester alkylique d'acide (méth)acrylique (A) qui contient 60 % en masse ou plus d'un monomère ester alkylique d'acide (méth)acrylique (a) dans lequel un groupe alkyle a 4 atomes de carbone ou moins ; et de 5 à 18 parties en masse d'un monomère contenant un groupe carboxyle (B). La composition adhésive selon la présente invention présente une adhérence élevée à une partie adhérée faiblement apte au collage telle qu'une résine de polypropylène, tout en ayant une diminution d'adhérence au cours du temps supprimée par rapport à une résine de poly(chlorure de vinyle) souple. L'invention concerne également un ruban adhésif qui utilise cette composition adhésive.
(JA) 本発明の粘着剤組成物は、重量平均分子量が55万~100万であるアクリル系重合体(X)100質量部、軟化点が140~160℃である粘着付与樹脂(Y)3~9質量部、及び架橋剤(Z)を含む粘着剤組成物である。前記アクリル系重合体(X)は、アルキル基の炭素数が4以下の(メタ)アクリル酸アルキルエステルモノマー(a)を60質量%以上含む(メタ)アクリル酸アルキルエステルモノマー(A)100質量部と、カルボキシル基含有モノマー(B)5~18質量部とを含むモノマー成分の重合体である。本発明によれば、ポリプロピレン樹脂等の難被着体に対して粘着力が高く、かつ軟質ポリ塩化ビニル樹脂に対して、経時的な粘着力の低下を抑制した粘着剤組成物、及び該粘着剤組成物を用いた粘着テープを提供することができる。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)