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1. (WO2019065994) POLISHING COMPOSITION
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Pub. No.: WO/2019/065994 International Application No.: PCT/JP2018/036320
Publication Date: 04.04.2019 International Filing Date: 28.09.2018
IPC:
C09K 3/14 (2006.01) ,B24B 37/00 (2012.01) ,C09G 1/02 (2006.01) ,H01L 21/304 (2006.01)
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
K
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
3
Materials not provided for elsewhere
14
Anti-slip materials; Abrasives
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37
Lapping machines or devices; Accessories
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
G
POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; SKI WAXES
1
Polishing compositions
02
containing abrasives or grinding agents
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304
Mechanical treatment, e.g. grinding, polishing, cutting
Applicants:
株式会社フジミインコーポレーテッド FUJIMI INCORPORATED [JP/JP]; 愛知県清須市西枇杷島町地領二丁目1番地1 1-1, Chiryo 2-chome, Nishibiwajima-cho, Kiyosu-shi, Aichi 4528502, JP
Inventors:
今 宏樹 KON, Hiroki; JP
野口 直人 NOGUCHI, Naoto; JP
Agent:
安部 誠 ABE, Makoto; JP
Priority Data:
2017-18936329.09.2017JP
Title (EN) POLISHING COMPOSITION
(FR) COMPOSITION DE POLISSAGE
(JA) 研磨用組成物
Abstract:
(EN) Provided is a polishing composition which is capable of achieving a good balance between high polishing rate and good surface quality. The present invention provides a polishing composition for polishing a polishing object material. This polishing composition contains sodium metavanadate, hydrogen peroxide and silica abrasive grains. The content C1 of the sodium metavanadate is from 0.7% by weight to 3.5% by weight; the content C2 of the hydrogen peroxide is from 0.3% by weight to 3% by weight; and the content C3 of the silica abrasive grains is from 12% by weight to 50% by weight.
(FR) L'invention concerne une composition de polissage qui peut atteindre un bon équilibre entre une vitesse élevée de polissage et une bonne qualité de surface. La présente invention concerne une composition de polissage pour polir un matériau d'objet de polissage. Cette composition de polissage contient du métavanadate de sodium, du peroxyde d'hydrogène et des grains abrasifs de silice. La teneur C1 en métavanadate de sodium est de 0,7 % en poids à 3,5 % en poids; la teneur C2 en peroxyde d'hydrogène est de 0,3 % en poids à 3 % en poids; et la teneur C3 en grains abrasifs de silice est de 12 % en poids à 50 % en poids.
(JA) 高い研磨レートと面品質とを両立し得る研磨用組成物を提供する。本発明によると、研磨対象材料を研磨するための研磨用組成物が提供される。この研磨用組成物は、メタバナジン酸ナトリウムと過酸化水素とシリカ砥粒とを含む。メタバナジン酸ナトリウムの含有量C1が0.7重量%~3.5重量%であり、過酸化水素の含有量C2が0.3重量%~3重量%であり、シリカ砥粒の含有量C3が12重量%~50重量%である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)