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1. (WO2019065965) ELECTROCONDUCTIVE PASTE
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Pub. No.: WO/2019/065965 International Application No.: PCT/JP2018/036253
Publication Date: 04.04.2019 International Filing Date: 28.09.2018
IPC:
H01B 1/22 (2006.01) ,H01B 1/00 (2006.01) ,H01L 21/288 (2006.01) ,H05K 1/09 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1
Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20
Conductive material dispersed in non-conductive organic material
22
the conductive material comprising metals or alloys
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1
Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
28
Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/268158
283
Deposition of conductive or insulating materials for electrodes
288
from a liquid, e.g. electrolytic deposition
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
09
Use of materials for the metallic pattern
Applicants:
ハリマ化成株式会社 HARIMA CHEMICALS, INC. [JP/JP]; 兵庫県加古川市野口町水足671番地の4 671-4, Mizuashi, Noguchi-cho, Kakogawa-shi, Hyogo 6750019, JP
Inventors:
中城 治之 NAKAJO Haruyuki; JP
上田 雅行 UEDA Masayuki; JP
中谷 誠登 NAKATANI Makoto; JP
細谷 一雄 HOSOYA Kazuo; JP
彌永 美樹 IYANAGA Miki; JP
Agent:
特許業務法人パテントボックス PATENTBOX IP LAW FIRM; 東京都千代田区岩本町2丁目19番9号 丸栄ビル 6F MARUEI Bldg 6th fl., 2-19-9, Iwamotocho, Chiyoda-ku Tokyo 1010032, JP
Priority Data:
2017-19211429.09.2017JP
2017-19211529.09.2017JP
Title (EN) ELECTROCONDUCTIVE PASTE
(FR) PÂTE ÉLECTROCONDUCTRICE
(JA) 導電性ペースト
Abstract:
(EN) An electroconductive paste is provided that has high bondability even to a substrate that has low bondability to silver. An electroconductive paste according to one embodiment of the present invention contains: silver particles that, as a first average particle diameter, have an average particle diameter within the range of 1-500 nm; one or more metals selected from the group comprising aluminum, titanium, vanadium, chromium, manganese, iron, cobalt, nickel, copper, zinc, zirconium, niobium, molybdenum, hafnium, tantalum, tungsten, indium, tin, gallium, germanium, and bismuth; and an amine compound, the substance amount of the amine compound being equal to or greater than the substance amount of the metal.
(FR) L'invention concerne une pâte électroconductrice qui présente une capacité de liaison élevée même à un substrat qui a une capacité de liaison faible à l'argent. Une pâte électroconductrice selon un mode de réalisation de la présente invention contient : des particules d'argent qui, en tant que premier diamètre de particule moyen, ont un diamètre moyen de particule dans la plage de 1 à 500 nm ; un ou plusieurs métaux choisis dans le groupe comprenant l'aluminium, le titane, le vanadium, le chrome, le manganèse, le fer, le cobalt, le nickel, le cuivre, le zinc, le zirconium, le niobium, le molybdène, l'hafnium, le tantale, le tungstène, l'indium, l'étain, le gallium, le germanium, et le bismuth ; et un composé amine, la quantité de substance du composé amine étant supérieure ou égale à la quantité de substance du métal.
(JA) 銀に対して接合性が低い基材に対しても高い接合性を有する導電性ペーストを提供する。本発明の一実施形態に係る導電性ペーストは、第1の平均粒子径として平均粒子径が1~500nmの範囲内にある銀粒子と、アルミニウム、チタン、バナジウム、クロム、マンガン、鉄、コバルト、ニッケル、銅、亜鉛、ジルコニウム、ニオブ、モリブデン、ハフニウム、タンタル、タングステン、インジウム、スズ、ガリウム、ゲルマニウム及びビスマスの群から選択される1つ又は2つ以上の金属と、アミン化合物と、を含み、前記アミン化合物の物質量が、前記金属の物質量以上である。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)