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1. (WO2019065726) SUBSTRATE FOR MOUNTING LIGHT-EMITTING ELEMENT, CIRCUIT SUBSTRATE FOR MOUNTING LIGHT-EMITTING ELEMENT COMPRISING SAME, AND LIGHT-EMITTING ELEMENT MODULE
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Pub. No.: WO/2019/065726 International Application No.: PCT/JP2018/035664
Publication Date: 04.04.2019 International Filing Date: 26.09.2018
IPC:
C04B 35/111 (2006.01) ,H01L 33/62 (2010.01) ,H05K 1/03 (2006.01)
C CHEMISTRY; METALLURGY
04
CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
B
LIME; MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
35
Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
01
based on oxides
10
based on aluminium oxide
111
Fine ceramics
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
62
Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
Applicants:
京セラ株式会社 KYOCERA CORPORATION [JP/JP]; 京都府京都市伏見区竹田鳥羽殿町6番地 6, Takeda Tobadono-cho, Fushimi-ku, Kyoto-shi, Kyoto 6128501, JP
Inventors:
松下 浩司 MATSUSHITA,Kouji; JP
Priority Data:
2017-18849428.09.2017JP
Title (EN) SUBSTRATE FOR MOUNTING LIGHT-EMITTING ELEMENT, CIRCUIT SUBSTRATE FOR MOUNTING LIGHT-EMITTING ELEMENT COMPRISING SAME, AND LIGHT-EMITTING ELEMENT MODULE
(FR) SUBSTRAT POUR MONTAGE D'ÉLÉMENT ÉLECTROLUMINESCENT, SUBSTRAT DE CIRCUIT POUR MONTAGE D'ÉLÉMENT ÉLECTROLUMINESCENT LE COMPRENANT, ET MODULE D'ÉLÉMENT ÉLECTROLUMINESCENT
(JA) 発光素子実装用基板およびこれを備える発光素子実装用回路基板ならびに発光素子モジュール
Abstract:
(EN) The substrate for mounting a light-emitting element according to the present disclosure comprises an alumina ceramic including crystal particles of aluminium oxide and containing 97 mass% or more of Al in terms of Al2O3 in 100 mass% of the whole components. The crystal particles have an average equivalent circle diameter of 1.1-1.8 μm and a standard deviation of equivalent circle diameter of 0.6-1.4 μm. Further, the circuit substrate for mounting a light-emitting element according to the present disclosure comprises a base, which is a separated piece of the substrate for mounting a light-emitting element according to the present disclosure, and a metal layer located on the base. Furthermore, the light-emitting element module of the present disclosure comprises the circuit substrate for mounting a light-emitting element according to the present disclosure, and a light-emitting element located on the metal layer.
(FR) Le substrat pour le montage d'un élément électroluminescent selon la présente invention comprend une céramique d'alumine comprenant des particules cristallines d'oxyde d'aluminium et contenant 97 % en masse ou plus d'Al en termes d'Al2O3 pour 100 % en masse des composants entiers. Les particules cristallines ont un diamètre de cercle équivalent moyen de 1,1 à 1,8 µm et un écart-type de diamètre de cercle équivalent de 0,6 à 1,4 µm. En outre, le substrat de circuit pour montage d’un élément électroluminescent selon la présente invention comprend une base, qui est une pièce séparée du substrat pour le montage d'un élément électroluminescent selon la présente invention, et une couche métallique située sur la base. En outre, le module d'élément électroluminescent de la présente invention comprend le substrat de circuit pour montage d’un élément électroluminescent selon la présente invention, et un élément électroluminescent situé sur la couche métallique.
(JA) 本開示の発光素子実装用基板は、酸化アルミニウムの結晶粒子を含有し、全成分100質量%のうち、AlをAl23に換算した値で97質量%以上含有するアルミナ質セラミックスからなる。そして、結晶粒子は、円相当径の平均値が1.1μm以上1.8μm以下であり、円相当径の標準偏差が0.6μm以上1.4μm以下である。また、本開示の発光素子実装用回路基板は、本開示の発光素子実装用基板から個片とされた基体と、該基体上に位置する金属層とを備える。さらに、本開示の発光素子モジュールは、本開示の発光素子実装用回路基板と、前記金属層上に位置する発光素子とを備える。 
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)