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1. (WO2019065725) SUBSTRATE FOR MOUNTING ELECTRONIC ELEMENT, AND ELECTRONIC DEVICE
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Pub. No.: WO/2019/065725 International Application No.: PCT/JP2018/035663
Publication Date: 04.04.2019 International Filing Date: 26.09.2018
IPC:
H01L 23/12 (2006.01) ,H01L 23/02 (2006.01) ,H01L 23/36 (2006.01) ,H01L 25/04 (2014.01) ,H01L 25/18 (2006.01) ,H01S 5/024 (2006.01) ,H05K 3/46 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
02
Containers; Seals
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
18
the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/-H01L51/160
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
S
DEVICES USING STIMULATED EMISSION
5
Semiconductor lasers
02
Structural details or components not essential to laser action
024
Cooling arrangements
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
46
Manufacturing multi-layer circuits
Applicants:
京セラ株式会社 KYOCERA CORPORATION [JP/JP]; 京都府京都市伏見区竹田鳥羽殿町6番地 6, Takeda Tobadono-cho, Fushimi-ku, Kyoto-shi, Kyoto 6128501, JP
Inventors:
森田 幸雄 MORITA,Yukio; JP
北住 登 KITAZUMI,Noboru; JP
Priority Data:
2017-18849328.09.2017JP
Title (EN) SUBSTRATE FOR MOUNTING ELECTRONIC ELEMENT, AND ELECTRONIC DEVICE
(FR) SUBSTRAT DE MONTAGE D'UN ÉLÉMENT ÉLECTRONIQUE, ET DISPOSITIF ÉLECTRONIQUE
(JA) 電子素子搭載用基板および電子装置
Abstract:
(EN) A substrate for mounting an electronic element comprises: a first substrate that has a first principal surface, and has a rectangular shape having an electronic element mounting part positioned on the first principal surface; and a second substrate that is positioned on a second principal surface facing the first principal surface, comprises a carbon material, has a rectangular shape, and has a third principal surface opposing the second principal surface and a fourth principal surface facing the third principal surface, the second substrate being such that, in plan view, for the third principal surface or the fourth principal surface, the thermal conduction in the longitudinal direction is greater than the thermal conduction in a direction perpendicularly intersecting the longitudinal direction, and a recess being included in the fourth principal surface.
(FR) La présente invention concerne un substrat de montage d'un élément électronique, comprenant : un premier substrat qui présente une première surface principale et revêt une forme rectangulaire présentant une partie de montage d'élément électronique placée sur la première surface principale ; et un second substrat qui est placé sur une deuxième surface principale faisant face à la première surface principale, qui contient un matériau carboné et revêt une forme rectangulaire, et qui présente une troisième surface principale faisant face à la deuxième surface principale ainsi qu'une quatrième surface principale faisant face à la troisième surface principale, le deuxième substrat étant tel que, dans une vue en plan, en ce qui concerne la troisième ou la quatrième surface principale, la conduction thermique dans la direction longitudinale est supérieure à la conduction thermique dans une direction coupant perpendiculairement la direction longitudinale, et un renfoncement étant ménagé dans la quatrième surface principale.
(JA) 電子素子搭載用基板は、第1主面を有し、第1主面に位置した電子素子の搭載部を有した矩形状である第1基板と、第1主面と相対する第2主面に位置し、炭素材料からなり、矩形状であって、第2主面と対向する第3主面および第3主面と相対する第4主面を有し、平面透視において、第3主面または第4主面が、長手方向の熱伝導が長手方向に垂直に交わる方向の熱伝導より大きく、第4主面に凹部を含む第2基板とを備えている。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)