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1. (WO2019065567) CURABLE COMPOSITION FOR IMPRINTS, METHOD FOR PRODUCING CURED PRODUCT PATTERN, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND CURED PRODUCT
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Pub. No.: WO/2019/065567 International Application No.: PCT/JP2018/035293
Publication Date: 04.04.2019 International Filing Date: 25.09.2018
IPC:
H01L 21/027 (2006.01) ,B29C 59/02 (2006.01) ,C08F 2/48 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
027
Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L21/18 or H01L21/34165
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
59
Surface shaping, e.g. embossing; Apparatus therefor
02
by mechanical means, e.g. pressing
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
F
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
2
Processes of polymerisation
46
Polymerisation initiated by wave energy or particle radiation
48
by ultra-violet or visible light
Applicants:
富士フイルム株式会社 FUJIFILM CORPORATION [JP/JP]; 東京都港区西麻布2丁目26番30号 26-30, Nishiazabu 2-chome, Minato-ku, Tokyo 1068620, JP
Inventors:
後藤 雄一郎 GOTO Yuichiro; JP
Agent:
特許業務法人特許事務所サイクス SIKS & CO.; 東京都中央区京橋一丁目8番7号 京橋日殖ビル8階 8th Floor, Kyobashi-Nisshoku Bldg., 8-7, Kyobashi 1-chome, Chuo-ku, Tokyo 1040031, JP
Priority Data:
2017-18609127.09.2017JP
Title (EN) CURABLE COMPOSITION FOR IMPRINTS, METHOD FOR PRODUCING CURED PRODUCT PATTERN, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND CURED PRODUCT
(FR) COMPOSITION DURCISSABLE POUR EMPREINTES, PROCÉDÉ DE PRODUCTION D'UN MOTIF DE PRODUIT DURCI, PROCÉDÉ DE FABRICATION DE CARTE DE CIRCUIT IMPRIMÉ ET PRODUIT DURCI
(JA) インプリント用硬化性組成物、硬化物パターンの製造方法、回路基板の製造方法および硬化物
Abstract:
(EN) Provided are a curable composition for imprints, a method for producing a cured product pattern, a method for manufacturing a circuit board, and a cured product, wherein both good curability at low irradiation levels and inhibition of overreaction can be achieved. This curable composition for imprints satisfies requirements A to C below. A: contains a polyfunctional polymerizable compound having a polymerizable group equivalent weight of at least 150; B: contains a photopolymerization initiator; C: contains 0.5-8 mass% of a UV absorber in nonvolatile components or 0.1-5 mass% of a polymerization inhibitor in the nonvolatile components or both, wherein the extinction coefficient of the UV absorber at the maximum wavelength of an irradiation light source is at least 1/2 of the extinction coefficient of the photopolymerization initiator, and the nonvolatile components refer to components other than a solvent contained in the curable composition for imprints.
(FR) L'invention concerne une composition durcissable pour empreintes, un procédé de production d'un motif de produit durci, un procédé de fabrication d'une carte de circuit imprimé, et un produit durci, à la fois une bonne aptitude au durcissement à de faibles niveaux d'irradiation et une inhibition de la surréaction pouvant être obtenues. Cette composition durcissable pour empreintes satisfait les exigences A à C ci-dessous. A : contient un composé polymérisable polyfonctionnel ayant un poids équivalent de groupe polymérisable d'au moins 150 ; B : contient un initiateur de photopolymérisation ; C : contient 0,5 à 8 % en masse d'un absorbeur UV dans des composants non volatils ou 0,1 à 5 % en masse d'un inhibiteur de polymérisation dans les composants non volatils ou les deux, le coefficient d'extinction de l'absorbeur UV à la longueur d'onde maximale d'une source de lumière d'irradiation étant d'au moins 1/2 du coefficient d'extinction de l'initiateur de photopolymérisation, et les composants non volatils se réfèrent à des composants autres qu'un solvant contenu dans la composition durcissable pour des empreintes.
(JA) 低露光照射時の良好な硬化性と過反応の抑制性とを両立することができるインプリント用硬化性組成物、硬化物パターンの製造方法、回路基板の製造方法および硬化物の提供。A~Cを満たすインプリント用硬化性組成物;A:重合性基当量が150以上の多官能重合性化合物を含む;B:光重合開始剤を含む;C:照射光源の極大波長における吸光係数が光重合開始剤の吸光係数の1/2以上である紫外線吸収剤を不揮発性成分中に0.5~8質量%含むこと、および、重合禁止剤を不揮発性成分中に0.1~5質量%含むことの少なくとも一方を満たす;不揮発性成分とは、インプリント用硬化性組成物に含まれる溶剤を除いた成分をいう。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)