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1. (WO2019065533) CUTTING DEVICE FOR GLASS SUBSTRATE, CUTTING METHOD, PROGRAM, AND STORAGE MEDIUM
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Pub. No.: WO/2019/065533 International Application No.: PCT/JP2018/035188
Publication Date: 04.04.2019 International Filing Date: 21.09.2018
IPC:
C03B 33/09 (2006.01) ,B23K 26/08 (2014.01) ,B23K 26/50 (2014.01)
C CHEMISTRY; METALLURGY
03
GLASS; MINERAL OR SLAG WOOL
B
MANUFACTURE OR SHAPING OF GLASS, OR OF MINERAL OR SLAG WOOL; SUPPLEMENTARY PROCESSES IN THE MANUFACTURE OR SHAPING OF GLASS, OR OF MINERAL OR SLAG WOOL
33
Severing cooled glass
09
by thermal shock
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
08
Devices involving relative movement between laser beam and workpiece
[IPC code unknown for B23K 26/50]
Applicants:
三星ダイヤモンド工業株式会社 MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD. [JP/JP]; 大阪府摂津市香露園32番12号 32-12, Koroen, Settsu city, Osaka 5660034, JP
Inventors:
井村 淳史 IMURA, Atsushi; JP
Agent:
新樹グローバル・アイピー特許業務法人 SHINJYU GLOBAL IP; 大阪府大阪市北区南森町1丁目4番19号 サウスホレストビル South Forest Bldg., 1-4-19, Minamimori-machi, Kita-ku, Osaka-shi, Osaka 5300054, JP
Priority Data:
2017-18574727.09.2017JP
Title (EN) CUTTING DEVICE FOR GLASS SUBSTRATE, CUTTING METHOD, PROGRAM, AND STORAGE MEDIUM
(FR) DISPOSITIF DE COUPE POUR SUBSTRAT EN VERRE, PROCÉDÉ DE COUPE, PROGRAMME ET SUPPORT DE STOCKAGE
(JA) ガラス基板の切断装置、切断方法、プログラム、及び記憶媒体
Abstract:
(EN) Provided is a device that cuts a glass substrate by projecting light, and projects the light efficiently onto a location on the glass substrate where a cut line is to be formed. A cutting device 100 for a glass substrate G is provided with a light projecting device 1 and a light scanning device 3. The light projecting device 1 outputs cutting light L that cuts the glass substrate G. The light scanning device 3 moves a spot S of the cutting light L back and forth along the cutting direction of the glass substrate G. The light scanning device 3 limits the range in which the spot S of the cutting light L moves back and forth to a non-cut region, which is a region of the glass substrate G where no cut line C crack has been formed yet.
(FR) La présente invention concerne un dispositif qui coupe un substrat en verre en projetant de la lumière et qui projette la lumière efficacement sur un emplacement du substrat en verre où une ligne de coupe doit être formée. Un dispositif de coupe (100) de substrat en verre G est doté d'un dispositif de projection de lumière (1) et d'un dispositif de balayage de lumière (3). Le dispositif de projection de lumière (1) émet une lumière de coupe L qui coupe le substrat en verre G. Le dispositif de balayage de lumière (3) déplace un point S de la lumière de coupe L en va-et-vient le long de la direction de coupe du substrat en verre G. Le dispositif de balayage de lumière (3) limite la plage dans laquelle le point S de la lumière de coupe L se déplace en va-et-vient vers une région à ne pas couper, qui est une région du substrat en verre G où aucune fissure de ligne de coupe C ne s'est formée pour l'instant.
(JA) 光を照射することによりガラス基板を切断する装置において、当該光をガラス基板の切断ラインを形成したい箇所に効率よく照射する。ガラス基板Gの切断装置100は、光発生装置1と、光走査装置3と、を備える。光発生装置1は、ガラス基板Gを切断する切断光Lを出力する。光走査装置3は、切断光LのスポットSをガラス基板Gの切断方向に沿って往復移動させる装置である。光走査装置3は、切断光LのスポットSの往復移動の範囲を、ガラス基板Gの切断ラインCの亀裂が形成されていない未切断領域に制限する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)