Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2019065464) STRUCTURE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2019/065464 International Application No.: PCT/JP2018/034879
Publication Date: 04.04.2019 International Filing Date: 20.09.2018
IPC:
H05B 3/02 (2006.01) ,C04B 35/581 (2006.01) ,H01L 21/683 (2006.01) ,H05B 3/10 (2006.01) ,H05B 3/20 (2006.01) ,H05B 3/74 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
3
Ohmic-resistance heating
02
Details
C CHEMISTRY; METALLURGY
04
CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
B
LIME; MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
35
Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
515
based on non-oxides
58
based on borides, nitrides or silicides
581
based on aluminium nitride
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683
for supporting or gripping
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
3
Ohmic-resistance heating
10
Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
3
Ohmic-resistance heating
20
Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
3
Ohmic-resistance heating
68
Heating arrangements specially adapted for cooking plates or analogous hot-plates
74
Non-metallic plates
Applicants:
京セラ株式会社 KYOCERA CORPORATION [JP/JP]; 京都府京都市伏見区竹田鳥羽殿町6番地 6, Takeda Tobadono-cho, Fushimi-ku, Kyoto-shi, Kyoto 6128501, JP
Inventors:
川邊 保典 KAWANABE,Yasunori; JP
渡邉 大貴 WATANABE,Daiki; JP
大川 善裕 OKAWA,Yoshihiro; JP
Priority Data:
2017-18849228.09.2017JP
Title (EN) STRUCTURE
(FR) STRUCTURE
(JA) 構造体
Abstract:
(EN) A structure (10) of the present disclosure is provided with: a base body (1) composed of an aluminum nitride-based ceramic; a power supplying terminal (3) composed of tungsten or molybdenum; a junction layer (4) positioned between the base body (1) and the power supply terminal (3) so as to be in contact with the base body (1) and the power supply terminal (3); and an inner electrode (2) electrically connected to the power supply terminal (3). In the junction layer (4), components constituting the power supply terminal (3) and aluminum nitride constitute 90 vol% total of 100 vol% of the total volume of the junction layer (4).
(FR) Une structure (10) selon la présente invention comprend : un corps de base (1) composé d'une céramique à base de nitrure d'aluminium ; une borne d'alimentation électrique (3) composée de tungstène ou de molybdène ; une couche de jonction (4) positionnée entre le corps de base (1) et la borne d'alimentation électrique (3) de façon à être en contact avec le corps de base (1) et la borne d'alimentation électrique (3) ; et une électrode interne (2) connectée électriquement à la borne d'alimentation électrique (3). Dans la couche de jonction (4), les composants constituant la borne d'alimentation électrique (3) et le nitrure d'aluminium représentent 90 % en volume au total de 100 % en volume du volume total de la couche de jonction (4).
(JA) 本開示の構造体(10)は、窒化アルミニウム質セラミックスからなる基体(1)と、タングステンまたはモリブデンからなる給電端子(3)と、前記基体(1)および前記給電端子(3)の間においてそれぞれ接して位置する接合層(4)と、前記給電端子(3)に電気的に繋がる内部電極(2)とを備える。そして、前記接合層(4)が、該接合層(4)を構成する全体積100体積%のうち、前記給電端子(3)を構成する成分および窒化アルミニウムの合計で90体積%以上である。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)