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1. (WO2019065419) HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
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Pub. No.: WO/2019/065419 International Application No.: PCT/JP2018/034664
Publication Date: 04.04.2019 International Filing Date: 19.09.2018
IPC:
H04B 1/40 (2015.01) ,H04B 1/00 (2006.01)
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
B
TRANSMISSION
1
Details of transmission systems, not covered by a single one of groups H04B3/-H04B13/123; Details of transmission systems not characterised by the medium used for transmission
38
Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
40
Circuits
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
B
TRANSMISSION
1
Details of transmission systems, not covered by a single one of groups H04B3/-H04B13/123; Details of transmission systems not characterised by the medium used for transmission
Applicants:
株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP/JP]; 京都府長岡京市東神足1丁目10番1号 10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto 6178555, JP
Inventors:
浪花 優佑 NANIWA, Yusuke; JP
Agent:
吉川 修一 YOSHIKAWA, Shuichi; JP
傍島 正朗 SOBAJIMA, Masaaki; JP
Priority Data:
2017-19215729.09.2017JP
Title (EN) HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
(FR) MODULE HAUTE FRÉQUENCE ET DISPOSITIF DE COMMUNICATION
(JA) 高周波モジュールおよび通信装置
Abstract:
(EN) A high-frequency module (10) comprises a substrate (13), a first circuit (11) disposed on the substrate (13) and including an amplifier (A11) for amplifying a signal for diversity, and a second circuit (12) disposed on the substrate and including an amplifier (A21) for amplifying a signal for MIMO. The amplifier (A11) and the amplifier (A21) are formed in an integrated device (IC5) which is a single component, and are arranged in a center portion (C) when the substrate (13) is viewed in a plan view. The first circuit (11) includes an inductor (L17) connected to the amplifier (A11), and the second circuit (12) includes an inductor (L27) connected to the amplifier (A21). The amplifiers (A11, A21) may be disposed at the center portion of a main surface (15) of the substrate (13), and the inductors (L17, L27) may be disposed at the center portion of a main surface (14) of the substrate (13).
(FR) L'invention concerne un module haute fréquence (10) comprenant un substrat (13), un premier circuit (11) disposé sur le substrat (13) et comprenant un amplificateur (A11) pour amplifier un signal de diversité, et un second circuit (12) disposé sur le substrat et comprenant un amplificateur (A21) pour amplifier un signal pour MIMO. L'amplificateur (A11) et l'amplificateur (A21) sont formés dans un dispositif intégré (IC5) qui est un composant unique, et sont agencés dans une partie centrale (C) lorsque le substrat (13) est visualisé dans une vue en plan. Le premier circuit (11) comprend une inductance (L17) connectée à l'amplificateur (A11), et le second circuit (12) comprend une inductance (L27) connectée à l'amplificateur (A21). Les amplificateurs (A11, A21) peuvent être disposés au niveau de la partie centrale d'une surface principale (15) du substrat, et les inductances (L17, L27) peuvent être disposées au niveau de la partie centrale d'une surface principale (14) du substrat.
(JA) 高周波モジュール(10)は、基板(13)と、基板(13)に配置され、ダイバーシティ用の信号を増幅するための増幅器(A11)を含む第1回路(11)と、基板に配置され、MIMO用の信号を増幅するための増幅器(A21)を含む第2回路(12)と、を備え、増幅器(A11)と増幅器(A21)とは、単一の部品である集積デバイス(IC5)に形成され、基板(13)を平面視したときの中央部(C)に配置されている。第1回路(11)、増幅器(A11)に接続されたインダクタ(L17)を含み、第2回路(12)は、増幅器(A21)に接続されたインダクタ(L27)を含み、増幅器(A11、A21)は、基板(13)の主面(15)における中央部に配置され、インダクタ(L17、L27)は、基板(13)の主面(14)における中央部に配置されていてもよい。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)