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1. (WO2019065373) PHOTOSENSITIVE TRANSFER MATERIAL, METHOD FOR MANUFACTURING CIRCUIT WIRING, AND METHOD FOR MANUFACTURING TOUCH PANEL
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Pub. No.: WO/2019/065373 International Application No.: PCT/JP2018/034500
Publication Date: 04.04.2019 International Filing Date: 18.09.2018
IPC:
G03F 7/11 (2006.01) ,B32B 27/40 (2006.01) ,G03F 7/004 (2006.01) ,G03F 7/039 (2006.01) ,G06F 3/041 (2006.01) ,H05K 3/06 (2006.01)
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
09
characterised by structural details, e.g. supports, auxiliary layers
11
having cover layers or intermediate layers, e.g. subbing layers
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27
Layered products essentially comprising synthetic resin
40
comprising polyurethanes
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
04
Chromates
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
039
Macromolecular compounds which are photodegradable, e.g. positive electron resists
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
F
ELECTRIC DIGITAL DATA PROCESSING
3
Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
01
Input arrangements or combined input and output arrangements for interaction between user and computer
03
Arrangements for converting the position or the displacement of a member into a coded form
041
Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
02
in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
06
the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Applicants:
富士フイルム株式会社 FUJIFILM CORPORATION [JP/JP]; 東京都港区西麻布2丁目26番30号 26-30, Nishiazabu 2-chome, Minato-ku, Tokyo 1068620, JP
Inventors:
両角 一真 MOROZUMI, Kazumasa; JP
豊嶋 悠樹 TESHIMA, Yuki; JP
宮宅 一仁 MIYAKE, Kazuhito; JP
中村 秀之 NAKAMURA, Hideyuki; JP
漢那 慎一 KANNA, Shinichi; JP
Agent:
特許業務法人太陽国際特許事務所 TAIYO, NAKAJIMA & KATO; 東京都新宿区新宿4丁目3番17号 3-17, Shinjuku 4-chome, Shinjuku-ku, Tokyo 1600022, JP
Priority Data:
2017-19083329.09.2017JP
2018-16847110.09.2018JP
Title (EN) PHOTOSENSITIVE TRANSFER MATERIAL, METHOD FOR MANUFACTURING CIRCUIT WIRING, AND METHOD FOR MANUFACTURING TOUCH PANEL
(FR) MATÉRIAU DE TRANSFERT PHOTOSENSIBLE, PROCÉDÉ DE FABRICATION DE CÂBLAGE DE CIRCUIT, ET PROCÉDÉ DE FABRICATION DE PANNEAU TACTILE
(JA) 感光性転写材料、回路配線の製造方法及びタッチパネルの製造方法
Abstract:
(EN) The present invention provides a photosensitive transfer material having: a temporary supporting body; and a photosensitive resin layer that contains a photo-acid generator and a polymer containing a structural unit having a group in which an acid group is protected by an acidolyzable group; the photosensitive transfer material also having at least one layer containing a urethane compound or a modified olefin compound between the temporary supporting body and the photosensitive resin layer. The present invention also provides a method for manufacturing a circuit wiring and a method for manufacturing a touch panel using said photosensitive transfer material.
(FR) La présente invention concerne un matériau de transfert photosensible comprenant : un corps de support temporaire ; et une couche de résine photosensible qui contient un générateur de photo-acide et un polymère contenant un motif structural ayant un groupe dans lequel un groupe acide est protégé par un groupe acidolysable. Le matériau de transfert photosensible comprend également au moins une couche contenant un composé d'uréthane ou un composé d'oléfine modifié disposée entre le corps de support temporaire et la couche de résine photosensible. La présente invention concerne également un procédé de fabrication d'un câblage de circuit et un procédé de fabrication d'un panneau tactile à l'aide dudit matériau de transfert photosensible.
(JA) 仮支持体と、酸基が酸分解性基で保護された基を有する構成単位を含有する重合体及び光酸発生剤を含有する感光性樹脂層と、を有し、上記仮支持体と上記感光性樹脂層との間に、ウレタン化合物又は変性オレフィン化合物を含有する層を少なくとも1層有する感光性転写材料、並びに、上記感光性転写材料を用いた回路配線の製造方法及びタッチパネルの製造方法。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)