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1. (WO2019065357) POLISHING COMPOSITION
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Pub. No.: WO/2019/065357 International Application No.: PCT/JP2018/034401
Publication Date: 04.04.2019 International Filing Date: 18.09.2018
IPC:
C09K 3/14 (2006.01) ,B24B 37/00 (2012.01) ,H01L 21/304 (2006.01)
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
K
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
3
Materials not provided for elsewhere
14
Anti-slip materials; Abrasives
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37
Lapping machines or devices; Accessories
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304
Mechanical treatment, e.g. grinding, polishing, cutting
Applicants:
株式会社フジミインコーポレーテッド FUJIMI INCORPORATED [JP/JP]; 愛知県清須市西枇杷島町地領二丁目1番地1 1-1, Chiryo 2-chome, Nishibiwajima-cho, Kiyosu-shi, Aichi 4528502, JP
Inventors:
谷口 恵 TANIGUCHI, Megumi; JP
向井 貴俊 MUKAI, Takatoshi; JP
土屋 公亮 TSUCHIYA, Kohsuke; JP
Agent:
安部 誠 ABE, Makoto; JP
Priority Data:
2017-19117529.09.2017JP
Title (EN) POLISHING COMPOSITION
(FR) COMPOSITION DE POLISSAGE
(JA) 研磨用組成物
Abstract:
(EN) Provided is a polishing composition having excellent capability for removing protrusions at the hard laser mark periphery. This polishing composition contains abrasive grains, a basic compound, and water. The basic compound includes a combination of two or more types of quaternary ammonium compounds. The two or more types of quaternary ammonium compounds include tetramethyl ammonium hydroxide and one or more types selected from compounds represented by general formula (1). (In the formula, X- is a monovalent anion and R1, R2, R3, and R4 are each independently selected from the group consisting of C1-4 hydrocarbon groups. However, at least one of R1, R2, R3 and R4 is a C2-4 hydrocarbon group.)
(FR) L'invention concerne une composition de polissage ayant une excellente aptitude à éliminer des protubérances à la périphérie de marques laser dures. La composition de polissage contient des particules abrasives, un composé basique et de l'eau. Le composé basique comprend une combinaison d'au moins deux types de composés d'ammonium quaternaire. Les au moins deux types de composés d'ammonium quaternaire comprennent de l'hydroxyde de tétraméthyle ammonium et un ou plusieurs types choisis parmi des composés représentés par la formule générale (1). Dans la formule, X- est un anion monovalent et R1, R2, R3 et R4 sont tous choisis indépendamment dans le groupe composé de groupes C1-4-hydrocarbure. Cependant, R1, R2, R3 et/ou R4 est un groupe C2-4-hydrocarbure.
(JA) ハードレーザーマーク周縁の隆起を解消する性能に優れた研磨用組成物を提供する。本発明により提供される研磨用組成物は、砥粒と塩基性化合物と水とを含む。上記塩基性化合物は、2種以上の第四級アンモニウム化合物を組み合わせて含む。上記2種以上の第四級アンモニウム化合物は、水酸化テトラメチルアンモニウムと、以下の一般式(1)で表される化合物から選択される1種以上とを含む。 (式中のXは一価のアニオンであり、R,R,R,Rは、それぞれ独立に、炭素原子数1~4の炭化水素基からなる群から選択される。ただし、R,R,R,Rのうち少なくとも一つは炭素原子数2~4の炭化水素基である。)
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)