Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2019065351) PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT COMPRISING CURED FILM, ORGANIC EL DISPLAY DEVICE COMPRISING CURED FILM, METHOD FOR PRODUCING CURED FILM, AND METHOD FOR PRODUCING ORGANIC EL DISPLAY DEVICE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2019/065351 International Application No.: PCT/JP2018/034377
Publication Date: 04.04.2019 International Filing Date: 18.09.2018
IPC:
G03F 7/004 (2006.01) ,C08G 73/10 (2006.01) ,C08G 73/22 (2006.01) ,G03F 7/023 (2006.01) ,G03F 7/20 (2006.01) ,G09F 9/30 (2006.01) ,H01L 27/32 (2006.01) ,H01L 51/50 (2006.01) ,H05B 33/02 (2006.01) ,H05B 33/10 (2006.01) ,H05B 33/12 (2006.01) ,H05B 33/22 (2006.01)
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
04
Chromates
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
73
Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen or carbon, not provided for in groups C08G12/-C08G71/238
06
Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule; Polyhydrazides; Polyamide acids or similar polyimide precursors
10
Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
73
Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen or carbon, not provided for in groups C08G12/-C08G71/238
06
Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule; Polyhydrazides; Polyamide acids or similar polyimide precursors
22
Polybenzoxazoles
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
022
Quinonediazides
023
Macromolecular quinonediazides; Macromolecular additives, e.g. binders
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20
Exposure; Apparatus therefor
G PHYSICS
09
EDUCATING; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
F
DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9
Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30
in which the desired character or characters are formed by combining individual elements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28
including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32
with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
02
Details
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
10
Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
12
Light sources with substantially two-dimensional radiating surfaces
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
12
Light sources with substantially two-dimensional radiating surfaces
22
characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
Applicants:
東レ株式会社 TORAY INDUSTRIES, INC. [JP/JP]; 東京都中央区日本橋室町2丁目1番1号 1-1, Nihonbashi-Muromachi 2-chome, Chuo-ku, Tokyo 1038666, JP
Inventors:
亀本聡 KAMEMOTO, Satoshi; JP
首藤勇太 SHUTO, Yuta; JP
三好一登 MIYOSHI, Kazuto; JP
Priority Data:
2017-18450226.09.2017JP
Title (EN) PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT COMPRISING CURED FILM, ORGANIC EL DISPLAY DEVICE COMPRISING CURED FILM, METHOD FOR PRODUCING CURED FILM, AND METHOD FOR PRODUCING ORGANIC EL DISPLAY DEVICE
(FR) COMPOSITION DE RÉSINE PHOTOSENSIBLE, FILM DURCI, ÉLÉMENT COMPRENANT UN FILM DURCI, DISPOSITIF D'AFFICHAGE ÉLECTROLUMINESCENT ORGANIQUE COMPRENANT UN FILM DURCI, PROCÉDÉ DE PRODUCTION DE FILM DURCI, ET PROCÉDÉ DE PRODUCTION DE DISPOSITIF D'AFFICHAGE ÉLECTROLUMINESCENT ORGANIQUE
(JA) 感光性樹脂組成物、硬化膜、硬化膜を具備する素子、硬化膜を具備する有機EL表示装置、硬化膜の製造方法、および有機EL表示装置の製造方法
Abstract:
(EN) A photosensitive resin composition containing an alkali-soluble resin (A), a photo-acid generator (B), a heat crosslinking agent (C), a phenol-based antioxidant (D), and a compound (E2) having a phenol-based hydroxyl group of which the acid dissociation constant pKa at 25°C is no less than 6.0 and no more than 9.5; or a photosensitive resin composition containing an alkali-soluble resin (A), a photo-acid generator (B), a heat crosslinking agent (C), a phenol-based antioxidant (D), and a compound (E) having a phenol-based hydroxyl group other than (D); wherein the compound (E) having a phenol-based hydroxyl group other than (D) includes a compound (E1) having a phenol-based hydroxyl group and an electron withdrawing group in a molecule. Provided is a photosensitive resin composition that has exceptional chemical resistance while the cured film has high bending resistance even after a reliability test.
(FR) L'invention concerne une composition de résine photosensible contenant une résine soluble dans les alcalis (A), un générateur de photo-acide (B), un agent de réticulation thermique (C), un antioxydant à base de phénol (D), et un composé (E2) ayant un groupe hydroxyle à base de phénol dont le pKa constant de dissociation acide à 25 °C est supérieur ou égal à 6,0 et inférieur ou égal à 9,5 ; ou une composition de résine photosensible contenant une résine soluble dans les alcalis (A), un générateur de photo-acide (B), un agent de réticulation thermique (C), un antioxydant à base de phénol (D), et un composé (E) ayant un groupe hydroxyle à base de phénol autre que (D), le composé (E) ayant un groupe hydroxyle à base de phénol autre que (D) comprenant un composé (E1) ayant un groupe hydroxyle à base de phénol et un groupe attracteur d'électrons dans une molécule. L'invention permet d'obtenir une composition de résine photosensible qui présente une résistance chimique exceptionnelle et un film durci qui présente une résistance à la flexion élevée même après un essai de fiabilité.
(JA) アルカリ可溶性樹脂(A)、光酸発生剤(B)、熱架橋剤(C)、フェノール系酸化防止剤(D)、25℃における酸解離定数pKaが6.0以上9.5以下のフェノール系水酸基を有する化合物(E)を含有する感光性樹脂組成物、またはアルカリ可溶性樹脂(A)、光酸発生剤(B)、熱架橋剤(C)、フェノール系酸化防止剤(D)、(D)以外のフェノール系水酸基を有する化合物(E)を含有する感光性樹脂組成物であって、前記(D)以外のフェノール系水酸基を有する化合物(E)が、分子内に電子吸引性基およびフェノール系水酸基を有する化合物(E)を含有する感光性樹脂組成物。 硬化膜が信頼性試験後も高い折り曲げ耐性を有しながら、耐薬品性にも優れた感光性樹脂組成物を提供する。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)