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1. (WO2019065294) IMAGING ELEMENT, METHOD FOR MANUFACTURING IMAGING ELEMENT, AND ELECTRONIC DEVICE
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/065294 International Application No.: PCT/JP2018/034126
Publication Date: 04.04.2019 International Filing Date: 14.09.2018
IPC:
H01L 27/146 (2006.01) ,G02B 1/115 (2015.01) ,G02B 5/20 (2006.01) ,G02B 7/02 (2006.01) ,G03B 17/02 (2006.01) ,H04N 5/225 (2006.01) ,H04N 5/335 (2011.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14
including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144
Devices controlled by radiation
146
Imager structures
[IPC code unknown for G02B 1/115]
G PHYSICS
02
OPTICS
B
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
5
Optical elements other than lenses
20
Filters
G PHYSICS
02
OPTICS
B
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
7
Mountings, adjusting means, or light-tight connections, for optical elements
02
for lenses
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
B
APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
17
Details of cameras or camera bodies; Accessories therefor
02
Bodies
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
N
PICTORIAL COMMUNICATION, e.g. TELEVISION
5
Details of television systems
222
Studio circuitry; Studio devices; Studio equipment
225
Television cameras
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
N
PICTORIAL COMMUNICATION, e.g. TELEVISION
5
Details of television systems
30
Transforming light or analogous information into electric information
335
using solid-state image sensors [SSIS]
Applicants:
ソニーセミコンダクタソリューションズ株式会社 SONY SEMICONDUCTOR SOLUTIONS CORPORATION [JP/JP]; 神奈川県厚木市旭町四丁目14番1号 4-14-1, Asahi-cho, Atsugi-shi, Kanagawa 2430014, JP
Inventors:
山本 篤志 YAMAMOTO Atsushi; JP
瀧本 香織 TAKIMOTO Kaori; JP
大岡 豊 OOKA Yutaka; JP
Agent:
西川 孝 NISHIKAWA Takashi; JP
稲本 義雄 INAMOTO Yoshio; JP
Priority Data:
2017-19042129.09.2017JP
Title (EN) IMAGING ELEMENT, METHOD FOR MANUFACTURING IMAGING ELEMENT, AND ELECTRONIC DEVICE
(FR) ÉLÉMENT D’IMAGERIE, PROCÉDÉ DE FABRICATION D’ÉLÉMENT D’IMAGERIE ET DISPOSITIF ÉLECTRONIQUE
(JA) 撮像素子、撮像素子の製造方法、および、電子機器
Abstract:
(EN) The present technology pertains to: an imaging element configured so as to be capable of precisely controlling the installation height of a lens; a method for manufacturing the imaging element; and an electronic device. The imaging element comprises: a laminated lens structure in which lens-attached substrates each having a lens disposed inside a through hole formed in the substrate are pasted together by direct bonding such that a plurality of lenses are laminated in the optical axis direction; an imaging unit which photoelectrically converts incident light condensed by the plurality of lenses of the laminated lens structure; a protective substrate which protects the imaging unit; and a spacer which is disposed between the protective substrate and the laminated lens structure. The present technology can be applied to a camera module or the like, for example.
(FR) La présente technologie concerne : un élément d'imagerie configuré de façon à être capable de commander avec précision la hauteur d'installation d'une lentille ; un procédé de fabrication de l'élément d'imagerie ; et un dispositif électronique. L'élément d'imagerie comprend : une structure de lentille stratifiée dans laquelle des substrats fixés à une lentille ayant chacun une lentille disposée à l'intérieur d'un trou traversant formé dans le substrat sont collés ensemble par liaison directe de telle sorte qu'une pluralité de lentilles sont stratifiées dans la direction de l'axe optique ; une unité d'imagerie qui convertit de manière photoélectrique la lumière incidente condensée par la pluralité de lentilles de la structure de lentille stratifiée ; un substrat de protection qui protège l'unité d'imagerie ; et un espaceur qui est disposé entre le substrat de protection et la structure de lentille stratifiée. La présente technique peut être appliquée à un module de batterie ou similaire, par exemple.
(JA) 本技術は、レンズ設置高さを高精度に制御することができるようにする撮像素子、撮像素子の製造方法、および、電子機器に関する。 撮像素子は、基板に形成された貫通孔の内側にレンズが配置されたレンズ付き基板どうしが直接接合により貼り合わされて複数枚のレンズが光軸方向に積層された積層レンズ構造体と、積層レンズ構造体の複数枚のレンズにより集光された入射光を光電変換する撮像部と、撮像部を保護する保護基板と、保護基板と積層レンズ構造体との間に配置されたスペーサとを備える。本技術は、例えば、カメラモジュール等に適用できる。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)