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1. (WO2019065293) IMAGING ELEMENT, METHOD FOR MANUFACTURING IMAGING ELEMENT, AND ELECTRONIC DEVICE
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/065293 International Application No.: PCT/JP2018/034125
Publication Date: 04.04.2019 International Filing Date: 14.09.2018
IPC:
G02B 7/02 (2006.01) ,G02B 5/00 (2006.01) ,G02B 13/00 (2006.01) ,G02B 13/18 (2006.01) ,G03B 15/00 (2006.01) ,G03B 17/02 (2006.01) ,H01L 27/146 (2006.01) ,H04N 5/225 (2006.01) ,H04N 5/335 (2011.01)
G PHYSICS
02
OPTICS
B
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
7
Mountings, adjusting means, or light-tight connections, for optical elements
02
for lenses
G PHYSICS
02
OPTICS
B
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
5
Optical elements other than lenses
G PHYSICS
02
OPTICS
B
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
13
Optical objectives specially designed for the purposes specified below
G PHYSICS
02
OPTICS
B
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
13
Optical objectives specially designed for the purposes specified below
18
with lenses having one or more non-spherical faces, e.g. for reducing geometrical aberration
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
B
APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
15
Special procedures for taking photographs; Apparatus therefor
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
B
APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
17
Details of cameras or camera bodies; Accessories therefor
02
Bodies
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14
including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144
Devices controlled by radiation
146
Imager structures
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
N
PICTORIAL COMMUNICATION, e.g. TELEVISION
5
Details of television systems
222
Studio circuitry; Studio devices; Studio equipment
225
Television cameras
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
N
PICTORIAL COMMUNICATION, e.g. TELEVISION
5
Details of television systems
30
Transforming light or analogous information into electric information
335
using solid-state image sensors [SSIS]
Applicants:
ソニーセミコンダクタソリューションズ株式会社 SONY SEMICONDUCTOR SOLUTIONS CORPORATION [JP/JP]; 神奈川県厚木市旭町四丁目14番1号 4-14-1, Asahi-cho, Atsugi-shi, Kanagawa 2430014, JP
Inventors:
引地 邦彦 HIKICHI Kunihiko; JP
Agent:
西川 孝 NISHIKAWA Takashi; JP
稲本 義雄 INAMOTO Yoshio; JP
Priority Data:
2017-19042029.09.2017JP
Title (EN) IMAGING ELEMENT, METHOD FOR MANUFACTURING IMAGING ELEMENT, AND ELECTRONIC DEVICE
(FR) ÉLÉMENT D’IMAGERIE, PROCÉDÉ DE FABRICATION D’ÉLÉMENT D’IMAGERIE, ET DISPOSITIF ÉLECTRONIQUE
(JA) 撮像素子、撮像素子の製造方法、および、電子機器
Abstract:
(EN) The present invention relates to an imaging element that makes it possible to reduce the size of a lens module while ensuring bonding strength between an image sensor and the module, a method for manufacturing the imaging element, and an electronic device. The imaging element is provided with: a layered lens structure in which lens-provided substrates, in which a lens is disposed inside a through hole formed in the substrate, are bonded together by direct bonding and layered; an imaging part for performing photoelectric conversion of incident light collected by the lenses; a protective substrate disposed between the imaging part and the layered lens structure; and an adhesive for bonding a top surface of the protective substrate and a bottom optical surface of the lens of the lowermost layer of the layered lens structure. The present invention can be applied to a camera module or the like, for example.
(FR) La présente invention concerne un élément d'imagerie qui permet de réduire la taille d'un module de lentille tout en assurant une force de liaison entre un capteur d'image et le module, un procédé de fabrication de l'élément d'imagerie, et un dispositif électronique. L'élément d'imagerie est pourvu : d'une structure de lentille en couches dans laquelle des substrats fournis par une lentille, dans lesquels une lentille est disposée à l'intérieur d'un trou traversant formé dans le substrat, sont liés ensemble par liaison directe et en couches ; d'une partie d'imagerie permettant d'effectuer une conversion photoélectrique de la lumière incidente collectée par les lentilles ; d'un substrat de protection disposé entre la partie d'imagerie et la structure de lentille en couches ; et d'un adhésif permettant de coller une surface supérieure du substrat de protection et une surface optique inférieure de la lentille de la couche la plus basse de la structure de lentille en couches. La présente invention peut être appliquée à un module de caméra ou analogue, par exemple.
(JA) 本技術は、イメージセンサとレンズモジュールの接合強度を確保しつつ、モジュールの小型化を可能にすることができるようにする撮像素子、撮像素子の製造方法、および、電子機器に関する。 撮像素子は、基板に形成された貫通孔の内側にレンズが配置されたレンズ付き基板どうしが直接接合により接合されて積層されている積層レンズ構造体と、レンズにより集光された入射光を光電変換する撮像部と、撮像部と積層レンズ構造体の間に配置された保護基板と、積層レンズ構造体の最下層のレンズの下面の光学面と、保護基板の上面とを接合する接着剤とを備える。本技術は、例えば、カメラモジュール等に適用できる。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)