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1. (WO2019065221) PASTE COMPOSITION, SEMICONDUCTOR DEVICE, AND ELECTRICAL/ELECTRONIC COMPONENT
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2019/065221 International Application No.: PCT/JP2018/033688
Publication Date: 04.04.2019 International Filing Date: 11.09.2018
IPC:
H01B 1/22 (2006.01) ,H01B 1/00 (2006.01) ,H01L 21/52 (2006.01) ,H01L 33/62 (2010.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1
Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20
Conductive material dispersed in non-conductive organic material
22
the conductive material comprising metals or alloys
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1
Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
52
Mounting semiconductor bodies in containers
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
62
Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
Applicants:
京セラ株式会社 KYOCERA CORPORATION [JP/JP]; 京都府京都市伏見区竹田鳥羽殿町6番地 6, Takeda Tobadono-cho, Fushimi-ku, Kyoto-shi, Kyoto 6128501, JP
Inventors:
荒川 陽輔 ARAKAWA Yosuke; JP
Agent:
特許業務法人サクラ国際特許事務所 SAKURA PATENT OFFICE, P.C.; 東京都千代田区内神田一丁目18番14号 ヨシザワビル Yoshizawa Bldg., 18-14, Uchikanda 1-chome, Chiyoda-ku, Tokyo 1010047, JP
Priority Data:
2017-18567527.09.2017JP
Title (EN) PASTE COMPOSITION, SEMICONDUCTOR DEVICE, AND ELECTRICAL/ELECTRONIC COMPONENT
(FR) COMPOSITION DE PÂTE, DISPOSITIF À SEMI-CONDUCTEUR ET COMPOSANT ÉLECTRONIQUE/ÉLECTRIQUE
(JA) ペースト組成物、半導体装置及び電気・電子部品
Abstract:
(EN) To provide a paste composition for semiconductor bonding and a paste composition for a light emitting device, the pastes having excellent high thermal conductivity and heat dissipation properties and being capable of satisfactorily bonding a semiconductor element and a light emitting element to a substrate without pressure. The present invention pertains to a paste composition that contains (A) fine silver particles having a thickness or a short diameter of 1 to 200 nm, (B) silver powder, other than the (A) fine silver particles, having an average particle diameter of over 0.2 μm but no more than 30 μm, and (C) a sintering aid containing an acid anhydride structure, wherein the (C) sintering aid is compounded at 0.01 to 1 parts by mass when the total amount of the (A) fine silver particles and the (B) silver powder is 100 parts by mass; a semiconductor device that uses the paste composition as a die attach paste; and electrical/electronic components that use the paste composition as a material for bonding heat dissipating members.
(FR) L’invention concerne une composition de pâte pour le collage de semi-conducteurs et une composition de pâte pour un dispositif électroluminescent, les pâtes présentant d’excellentes propriétés de conductivité thermique élevée et de dissipation de chaleur et étant capable de coller de manière fiable un élément semi-conducteur et un élément électroluminescent à un substrat sans l’application d’une pression. La présente invention concerne une composition de pâte qui contient (A) de fines particules d'argent ayant une épaisseur ou un petit diamètre de 1 à 200 nm, (B) une poudre d'argent, autre que la poudre (A) de fines particules d'argent, ayant un diamètre moyen de particule de plus de 0,2 µm mais pas plus de 30 µm, et (C) un auxiliaire de frittage contenant une structure d'anhydride d'acide, (C) l'auxiliaire de frittage étant composé de 0,01 à 1 parties en masse lorsque la quantité totale des (A) fines particules d'argent et de (B) la poudre d'argent est de 100 parties en masse ; un dispositif à semi-conducteur qui utilise la composition de pâte en tant que pâte de fixation de puce ; et des composants électriques/électroniques qui utilisent la composition de pâte en tant que matériau pour le collage des éléments de dissipation de chaleur.
(JA) 高熱伝導性、熱放散性に優れ、半導体素子及び発光素子を基板に無加圧で良好に接合できる半導体接着用ペースト組成物及び発光装置用ペースト組成物を提供する。 (A)厚さ又は短径が1~200nmの銀微粒子と、(B)前記(A)銀微粒子以外の平均粒子径が0.2μm超30μm以下である銀粉と、(C)酸無水物構造を含む焼結助剤と、を含み、(A)銀微粒子と(B)銀粉の合計量を100質量部としたとき、(C)焼結助材が0.01~1質量部、配合されているペースト組成物、該ペースト組成物をダイアタッチペーストとして使用した半導体装置及び放熱部材接着用材料として使用した電気・電子部品。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)