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1. (WO2019065182) ULTRASONIC SENSOR
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Pub. No.: WO/2019/065182 International Application No.: PCT/JP2018/033437
Publication Date: 04.04.2019 International Filing Date: 10.09.2018
IPC:
H04R 17/00 (2006.01) ,B81B 3/00 (2006.01) ,H01L 41/09 (2006.01) ,H01L 41/113 (2006.01) ,H01L 41/187 (2006.01)
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
R
LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
17
Piezo-electric transducers; Electrostrictive transducers
B PERFORMING OPERATIONS; TRANSPORTING
81
MICRO-STRUCTURAL TECHNOLOGY
B
MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-MECHANICAL DEVICES
3
Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
41
Piezo-electric devices in general; Electrostrictive devices in general; Magnetostrictive devices in general; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
08
Piezo-electric or electrostrictive elements
09
with electrical input and mechanical output
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
41
Piezo-electric devices in general; Electrostrictive devices in general; Magnetostrictive devices in general; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
08
Piezo-electric or electrostrictive elements
113
with mechanical input and electrical output
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
41
Piezo-electric devices in general; Electrostrictive devices in general; Magnetostrictive devices in general; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
16
Selection of materials
18
for piezo-electric or electrostrictive elements
187
Ceramic compositions
Applicants:
第一精工株式会社 DAI-ICHI SEIKO CO., LTD. [JP/JP]; 京都府京都市伏見区桃山町根来12番地の4 12-4 Negoro, Momoyama-cho, Fushimi-ku, Kyoto-shi, Kyoto 6128024, JP
Inventors:
緒方 健治 OGATA Kenji; JP
黒木 省吾 KUROGI Shogo; JP
Agent:
木村 満 KIMURA Mitsuru; JP
Priority Data:
2017-18575627.09.2017JP
Title (EN) ULTRASONIC SENSOR
(FR) CAPTEUR ULTRASONORE
(JA) 超音波センサ
Abstract:
(EN) A fixed frame (2) is fixed to an external member. An ultrasonic oscillation unit (3) is constituted by a first substrate arranged inside the fixed frame (2) and having flexibility and a first piezoelectric element formed on the first substrate by thin film deposition, the ultrasonic oscillation unit (3) generating an ultrasonic wave by being bent due to expansion/contraction of the first piezoelectric element. An actuator unit (4) is constituted by a second substrate connecting between the first substrate and the fixed frame (2) and having flexibility and a second piezoelectric element formed on the second substrate by thin film deposition, the actuator unit (4) causing the ultrasonic oscillation unit (3) to be oscillated relative to the fixed frame (2) by being bent due to expansion/contraction of the second piezoelectric element. The first substrate and second substrate of the fixed frame (2) are composed of the same substrate.
(FR) L'invention concerne un cadre fixe (2) qui est fixé à un élément externe. Une unité d'oscillation ultrasonore (3) est constituée par un premier substrat agencé à l'intérieur du cadre fixe (2) et présentant une flexibilité et un premier élément piézoélectrique formé sur le premier substrat par dépôt de film mince, l'unité d'oscillation ultrasonore (3) générant une onde ultrasonore en étant pliée en raison de l'expansion/contraction du premier élément piézoélectrique. Une unité d'actionneur (4) est constituée par un second substrat se connectant entre le premier substrat et le cadre fixe (2) et présentant une flexibilité et un second élément piézoélectrique formé sur le second substrat par dépôt de film mince, l'unité d'actionneur (4) amenant l'unité d'oscillation ultrasonore (3) à osciller par rapport au cadre fixe (2) en étant pliée en raison de l'expansion/contraction du second élément piézoélectrique. Le premier substrat et le second substrat du cadre fixe (2) sont composés du même substrat.
(JA) 固定枠(2)は、外部の部材に固定される。超音波発振部(3)は、固定枠(2)内に配置され、可撓性を有する第1の基板と第1の基板上に薄膜形成された第1の圧電素子とで構成され、第1の圧電素子の伸縮により撓んで超音波を発生する。アクチュエータ部(4)は、第1の基板と固定枠(2)との間を接続し可撓性を有する第2の基板と、第2の基板上に薄膜形成された第2の圧電素子とで構成され、第2の圧電素子の伸縮により撓んで固定枠(2)に対して超音波発振部(3)を揺動させる。固定枠(2)、第1の基板及び第2の基板が同一の基板で構成されている。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)