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1. (WO2019065164) POLYIMIDE PRECURSOR RESIN COMPOSITION, POLYIMIDE RESIN COMPOSITION, POLYIMIDE RESIN FILM, PRODUCTION METHOD FOR LAYERED PRODUCT, PRODUCTION METHOD FOR COLOR FILTER, PRODUCTION METHOD FOR LIQUID CRYSTAL ELEMENT, AND PRODUCTION METHOD FOR ORGANIC EL ELEMENT
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2019/065164 International Application No.: PCT/JP2018/033281
Publication Date: 04.04.2019 International Filing Date: 07.09.2018
IPC:
C08L 79/08 (2006.01) ,B32B 9/00 (2006.01) ,B32B 27/34 (2006.01) ,C08G 73/10 (2006.01) ,G02B 5/20 (2006.01) ,G02F 1/1333 (2006.01) ,H01L 51/50 (2006.01) ,H05B 33/02 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
79
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08L61/-C08L77/259
04
Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
08
Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
9
Layered products essentially comprising a particular substance not covered by groups B32B11/-B32B29/137
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27
Layered products essentially comprising synthetic resin
34
comprising polyamides
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
73
Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen or carbon, not provided for in groups C08G12/-C08G71/238
06
Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule; Polyhydrazides; Polyamide acids or similar polyimide precursors
10
Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
G PHYSICS
02
OPTICS
B
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
5
Optical elements other than lenses
20
Filters
G PHYSICS
02
OPTICS
F
DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
1
Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
01
for the control of the intensity, phase, polarisation or colour
13
based on liquid crystals, e.g. single liquid crystal display cells
133
Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
1333
Constructional arrangements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
02
Details
Applicants:
東レ株式会社 TORAY INDUSTRIES, INC. [JP/JP]; 東京都中央区日本橋室町2丁目1番1号 1-1, Nihonbashi-Muromachi 2-chome, Chuo-ku, Tokyo 1038666, JP
Inventors:
佐伯 昭典 SAEKI, Akinori; JP
立花 康子 TACHIBANA, Yasuko; JP
宮崎 大地 MIYAZAKI, Daichi; JP
Agent:
特許業務法人酒井国際特許事務所 SAKAI INTERNATIONAL PATENT OFFICE; 東京都千代田区霞が関3丁目8番1号 虎の門三井ビルディング Toranomon Mitsui Building, 8-1, Kasumigaseki 3-chome, Chiyoda-ku, Tokyo 1000013, JP
Priority Data:
2017-18450126.09.2017JP
Title (EN) POLYIMIDE PRECURSOR RESIN COMPOSITION, POLYIMIDE RESIN COMPOSITION, POLYIMIDE RESIN FILM, PRODUCTION METHOD FOR LAYERED PRODUCT, PRODUCTION METHOD FOR COLOR FILTER, PRODUCTION METHOD FOR LIQUID CRYSTAL ELEMENT, AND PRODUCTION METHOD FOR ORGANIC EL ELEMENT
(FR) COMPOSITION DE RÉSINE DE PRÉCURSEUR DE POLYIMIDE, COMPOSITION DE RÉSINE DE POLYIMIDE, FILM DE RÉSINE DE POLYIMIDE, PROCÉDÉ DE PRODUCTION D'UN PRODUIT STRATIFIÉ, PROCÉDÉ DE PRODUCTION D'UN FILTRE COULEUR, PROCÉDÉ DE PRODUCTION D'UN ÉLÉMENT CRISTAL LIQUIDE, ET PROCÉDÉ DE PRODUCTION D'UN ÉLÉMENT EL ORGANIQUE
(JA) ポリイミド前駆体樹脂組成物、ポリイミド樹脂組成物、ポリイミド樹脂膜、積層体の製造方法、カラーフィルタの製造方法、液晶素子の製造方法および有機EL素子の製造方法
Abstract:
(EN) This polyimide precursor resin composition contains: a polyimide precursor (A) containing a structure represented by general formula (1) and a structural unit represented by general formula (2); and a solvent (B). The polyimide precursor (A) contains 5-30 mass% of the structure represented by general formula (1), where the amount of the entire polyimide precursor (A) is 100 mass%. The solvent (B) contains at least one solvent (B1) having an SP value of 7.7-9.0, and at least one solvent (B2) having an SP value of more than 9.0 but not more than 12.5. (In general formula (1), R1 and R2 each independently represent a monovalent organic group having 1-20 carbon atoms, and m represents an integer of 3-200.) (In general formula (2), R3 represents a divalent organic group, R4 represents a tetravalent organic group, and Y1 and Y2 each independently represent a hydrogen atom, a monovalent organic group having 1-10 carbon atoms, or a monovalent alkylsilyl group having 1-10 carbon atoms.)
(FR) L'invention concerne une composition de résine de précurseur de polyimide, qui contient : un précurseur de polyimide (A) contenant une structure représentée par la formule générale (1) et un motif structural représenté par la formule générale (2) ; et un solvant (B). Le précurseur de polyimide (A) contient 5 à 30 % en masse de la structure représentée par la formule générale (1), la quantité du précurseur de polyimide (A) total étant de 100 % en masse. Le solvant (B) contient au moins un solvant (B1) ayant un paramètre de solubilité de 7,7 à 9,0, et au moins un solvant (B2) ayant un paramètre de solubilité supérieur à 9,0 mais non supérieur à 12,5. (Dans la formule générale (1), R1 et R2 représentent chacun d'une manière indépendante un groupe organique monovalent ayant 1 à 20 atomes de carbone, et m représente un entier de 3 à 200.) (Dans la formule générale (2), R3 représente un groupe organique divalent, R4 représente un groupe organique tétravalent, et Y1 et Y2 représentent chacun d'une manière indépendante un atome d'hydrogène, un groupe organique monovalent ayant 1 à 10 atomes de carbone, ou un groupe alkylsilyle monovalent ayant 1 à 10 atomes de carbone.)
(JA) ポリイミド前駆体樹脂組成物は、一般式(1)で表される構造および一般式(2)で表される構造単位を含むポリイミド前駆体(A)と、溶媒(B)とを含む。ポリイミド前駆体(A)は、ポリイミド前駆体(A)全体の量を100質量%とした場合、一般式(1)で表される構造を5~30質量%含む。溶媒(B)は、SP値が7.7以上、9.0以下である溶媒(B1)と、SP値が9.0より大きく12.5以下である溶媒(B2)と、をそれぞれ1種以上含む。 (一般式(1)中、RおよびRは、各々独立に、炭素数1~20の一価の有機基を示す。mは3~200の整数を示す。) (一般式(2)中、Rは二価の有機基を示し、Rは四価の有機基を示す。YおよびYは、各々独立に、水素原子、炭素数1~10の一価の有機基または炭素数1~10の一価のアルキルシリル基を示す。)
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)