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1. (WO2019065150) HEAT-RADIATING SHEET AND DEVICE HAVING HEAT-RADIATING SHEET
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Pub. No.: WO/2019/065150 International Application No.: PCT/JP2018/033090
Publication Date: 04.04.2019 International Filing Date: 06.09.2018
IPC:
H01L 23/373 (2006.01) ,C08K 3/22 (2006.01) ,C08K 3/28 (2006.01) ,C08K 3/38 (2006.01) ,C08L 101/00 (2006.01) ,H01L 23/36 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
373
Cooling facilitated by selection of materials for the device
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
18
Oxygen-containing compounds, e.g. metal carbonyls
20
Oxides; Hydroxides
22
of metals
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
28
Nitrogen-containing compounds
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
38
Boron-containing compounds
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101
Compositions of unspecified macromolecular compounds
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
Applicants:
富士フイルム株式会社 FUJIFILM CORPORATION [JP/JP]; 東京都港区西麻布2丁目26番30号 26-30, Nishiazabu 2-chome, Minato-ku, Tokyo 1068620, JP
Inventors:
國安 諭司 KUNIYASU Satoshi; JP
佐野 貴之 SANO Takayuki; JP
Agent:
渡辺 望稔 WATANABE Mochitoshi; JP
伊東 秀明 ITOH Hideaki; JP
三橋 史生 MITSUHASHI Fumio; JP
Priority Data:
2017-18750428.09.2017JP
Title (EN) HEAT-RADIATING SHEET AND DEVICE HAVING HEAT-RADIATING SHEET
(FR) FEUILLE RAYONNANT LA CHALEUR ET DISPOSITIF AYANT LA FEUILLE RAYONNANT LA CHALEUR
(JA) 放熱シートおよび放熱シート付きデバイス
Abstract:
(EN) The present invention addresses the problem of providing a heat-radiating sheet that has exceptional heat radiation properties and a device having a heat-radiating sheet in which said heat-radiating sheet is used. This heat-radiating sheet contains a resin binder and inorganic particles, wherein the inorganic particles at least include inorganic particles B measuring in excess of 100 μm in size, and the average height Rc of one surface of the heat-radiating sheet and the other surface of the heat-radiating sheet is at least 0.1 μm and less than 2.0 μm.
(FR) La présente invention aborde le problème de fourniture d’une feuille rayonnant la chaleur dont les propriétés de rayonnement de chaleur sont exceptionnelles et d’un dispositif ayant une feuille rayonnant la chaleur dans lequel ladite feuille rayonnant la chaleur est utilisée. Cette feuille rayonnant la chaleur contient un liant de résine et des particules inorganiques, les particules inorganiques incluant au moins des particules inorganiques (B) dont la taille est supérieure à 100 µm, et la hauteur moyenne Rc d’une surface de la feuille rayonnant la chaleur et de l’autre surface de la feuille rayonnant la chaleur étant d’au moins 0,1 µm et inférieure à 2,0 µm.
(JA) 本発明は、優れた放熱性を有する放熱シートおよびそれを用いた放熱シート付きデバイスを提供すること課題とする。本発明の放熱シートは、樹脂バインダーと、無機粒子とを含有する放熱シートであって、無機粒子が、少なくとも、粒径100μm超の無機粒子Bを含み、放熱シートの一方および他方の表面の平均高さRcが、いずれも0.1μm以上2.0μm未満である、放熱シートである。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)