Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2019065148) HEAT DISSIPATION SHEET AND DEVICE PROVIDED WITH HEAT DISSIPATION SHEET
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2019/065148 International Application No.: PCT/JP2018/033079
Publication Date: 04.04.2019 International Filing Date: 06.09.2018
IPC:
H01L 23/36 (2006.01) ,C08K 3/22 (2006.01) ,C08K 3/28 (2006.01) ,C08K 3/38 (2006.01) ,C08L 101/00 (2006.01) ,H01L 23/373 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
18
Oxygen-containing compounds, e.g. metal carbonyls
20
Oxides; Hydroxides
22
of metals
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
28
Nitrogen-containing compounds
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
38
Boron-containing compounds
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101
Compositions of unspecified macromolecular compounds
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
373
Cooling facilitated by selection of materials for the device
Applicants:
富士フイルム株式会社 FUJIFILM CORPORATION [JP/JP]; 東京都港区西麻布2丁目26番30号 26-30, Nishiazabu 2-chome, Minato-ku, Tokyo 1068620, JP
Inventors:
國安 諭司 KUNIYASU Satoshi; JP
佐野 貴之 SANO Takayuki; JP
Agent:
渡辺 望稔 WATANABE Mochitoshi; JP
伊東 秀明 ITOH Hideaki; JP
三橋 史生 MITSUHASHI Fumio; JP
Priority Data:
2017-18747728.09.2017JP
Title (EN) HEAT DISSIPATION SHEET AND DEVICE PROVIDED WITH HEAT DISSIPATION SHEET
(FR) FEUILLE DE DISSIPATION DE CHALEUR ET DISPOSITIF COMPRENANT UNE FEUILLE DE DISSIPATION DE CHALEUR
(JA) 放熱シートおよび放熱シート付きデバイス
Abstract:
(EN) The present invention addresses the problem of providing: a heat dissipation sheet having exceptional heat dissipation properties; and a device provided with a heat dissipation sheet, in which said heat dissipation sheet is used. This heat dissipation sheet contains a resin binder and inorganic particles, wherein: the inorganic particles contain inorganic particles A having a grain diameter of 100 µm or less, and inorganic particles B having a grain diameter exceeding 100 µm; the inorganic particle A content is 10-30% by mass with respect to the total mass of the inorganic particles A and the inorganic particles B; and the inorganic particle B content is 70-90% by mass with respect to the total mass of the inorganic particles A and the inorganic particles B.
(FR) La présente invention aborde le problème consistant à fournir : une feuille de dissipation de chaleur ayant des propriétés de dissipation de chaleur exceptionnelles ; et un dispositif comprenant une feuille de dissipation de chaleur, dans lequel ladite feuille de dissipation de chaleur est utilisée. Cette feuille de dissipation de chaleur contient une résine liante et des particules inorganiques, les particules inorganiques contenant des particules inorganiques A ayant un diamètre de grain d'au maximum 100 µm, et des particules inorganiques B ayant un diamètre de grain dépassant 100 µm ; la teneur en particules inorganiques A est de 10 à 30 % en masse par rapport à la masse totale des particules inorganiques A et des particules inorganiques B ; et la teneur en particules inorganiques B est de 70 à 90 % en masse par rapport à la masse totale des particules inorganiques A et des particules inorganiques B.
(JA) 本発明は、優れた放熱性を有する放熱シートおよびそれを用いた放熱シート付きデバイスを提供すること課題とする。本発明の放熱シートは、樹脂バインダーと、無機粒子とを含有する放熱シートであって、無機粒子が、粒径100μm以下の無機粒子Aと、粒径100μm超の無機粒子Bとを含み、無機粒子Aの含有量が、無機粒子Aおよび無機粒子Bの合計質量に対して10~30質量%であり、無機粒子Bの含有量が、無機粒子Aおよび無機粒子Bの合計質量に対して70~90質量%である、放熱シートである。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)