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1. (WO2019065146) HEAT DISSIPATION SHEET AND HEAT DISSIPATION SHEET-EQUIPPED DEVICE
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Pub. No.: WO/2019/065146 International Application No.: PCT/JP2018/033039
Publication Date: 04.04.2019 International Filing Date: 06.09.2018
IPC:
H01L 23/36 (2006.01) ,C08K 3/22 (2006.01) ,C08K 3/28 (2006.01) ,C08K 3/38 (2006.01) ,C08L 101/00 (2006.01) ,H01L 23/373 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
18
Oxygen-containing compounds, e.g. metal carbonyls
20
Oxides; Hydroxides
22
of metals
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
28
Nitrogen-containing compounds
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
38
Boron-containing compounds
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101
Compositions of unspecified macromolecular compounds
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
373
Cooling facilitated by selection of materials for the device
Applicants:
富士フイルム株式会社 FUJIFILM CORPORATION [JP/JP]; 東京都港区西麻布2丁目26番30号 26-30, Nishiazabu 2-chome, Minato-ku, Tokyo 1068620, JP
Inventors:
國安 諭司 KUNIYASU Satoshi; JP
佐野 貴之 SANO Takayuki; JP
Agent:
渡辺 望稔 WATANABE Mochitoshi; JP
伊東 秀明 ITOH Hideaki; JP
三橋 史生 MITSUHASHI Fumio; JP
Priority Data:
2017-18803528.09.2017JP
Title (EN) HEAT DISSIPATION SHEET AND HEAT DISSIPATION SHEET-EQUIPPED DEVICE
(FR) FEUILLE DE DISSIPATION DE CHALEUR ET DISPOSITIF ÉQUIPÉ DE LA FEUILLE DE DISSIPATION DE CHALEUR
(JA) 放熱シートおよび放熱シート付きデバイス
Abstract:
(EN) The present invention addresses the problem of providing a heat dissipation sheet having excellent heat dissipation properties and a heat dissipation sheet-equipped device that uses this heat dissipation sheet. The heat dissipation sheet according to the present invention contains a resin binder and inorganic particles, wherein the inorganic particles contain inorganic particles A having a particle diameter of not more than 100 μm and inorganic particles B having a particle diameter in excess of 100 μm. At least 80% of the total number of inorganic particles A is present in a region X extending from one surface of the heat dissipation sheet in the thickness direction to one-third of the overall thickness of the heat dissipation sheet. At least 70% of the total number of the inorganic particles B is present in a region Y extending from the other surface of the heat dissipation sheet in the thickness direction to two-thirds of the overall thickness of the heat dissipation sheet.
(FR) La présente invention aborde le problème de la fourniture d'une feuille de dissipation de chaleur ayant d'excellentes propriétés de dissipation de chaleur et un dispositif équipé d'une feuille de dissipation de chaleur qui utilise cette feuille de dissipation de chaleur. La feuille de dissipation de chaleur selon la présente invention contient une résine liante et des particules inorganiques, les particules inorganiques contenant des particules inorganiques A ayant un diamètre de particule de pas plus de 100 µm et des particules inorganiques B ayant un diamètre de particule dépassant 100 µm. Au moins 80 % du nombre total de particules inorganiques A est présent dans une région X s'étendant d'une surface de la feuille de dissipation de chaleur dans le sens de l'épaisseur à un tiers de l'épaisseur globale de la feuille de dissipation de chaleur. Au moins 70 % du nombre total des particules inorganiques B est présent dans une région Y s'étendant à partir de l'autre surface de la feuille de dissipation de chaleur dans la direction de l'épaisseur jusqu'aux deux tiers de l'épaisseur globale de la feuille de dissipation de chaleur
(JA) 本発明は、優れた放熱性を有する放熱シートおよびそれを用いた放熱シート付きデバイスを提供すること課題とする。本発明の放熱シートは、樹脂バインダーと、無機粒子とを含有する放熱シートであって、無機粒子が、粒径100μm以下の無機粒子Aと、粒径100μm超の無機粒子Bとを含み、無機粒子Aの全数の80%以上が、放熱シートの一方の表面から厚み方向に放熱シートの全体厚みの1/3までの領域Xに存在し、無機粒子Bの全数の70%以上が、放熱シートの他方の表面から厚み方向に放熱シートの全体厚みの2/3までの領域Yに存在する、放熱シートである。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)