Some content of this application is unavailable at the moment.
If this situation persists, please contact us atFeedback&Contact
1. (WO2019065136) POLYIMIDE POWDER, POLYIMIDE VARNISH AND POLYIMIDE FILM
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/065136 International Application No.: PCT/JP2018/032955
Publication Date: 04.04.2019 International Filing Date: 06.09.2018
IPC:
C08L 79/08 (2006.01) ,C08G 73/10 (2006.01) ,C08J 5/18 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
79
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08L61/-C08L77/259
04
Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
08
Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
73
Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen or carbon, not provided for in groups C08G12/-C08G71/238
06
Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule; Polyhydrazides; Polyamide acids or similar polyimide precursors
10
Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5
Manufacture of articles or shaped materials containing macromolecular substances
18
Manufacture of films or sheets
Applicants:
河村産業株式会社 KAWAMURA SANGYO CO.,LTD. [JP/JP]; 三重県四日市市西大鐘町330 330, Nishi-Oganecho, Yokkaichi-shi, Mie 5128052, JP
Inventors:
田中 圭三 TANAKA Keizo; JP
山田 俊輔 YAMADA Shunsuke; JP
長島 豊 NAGASHIMA Yutaka; JP
清水 誠吾 SHIMIZU Seigo; JP
Agent:
特許業務法人 津国 TSUKUNI & ASSOCIATES; 東京都千代田区麹町5-3-1 麹町ビジネスセンター Kojimachi Business Center, 5-3-1, Kojimachi, Chiyoda-ku, Tokyo 1020083, JP
山村 大介 YAMAMURA Daisuke; JP
Priority Data:
2017-18475926.09.2017JP
2017-18476026.09.2017JP
Title (EN) POLYIMIDE POWDER, POLYIMIDE VARNISH AND POLYIMIDE FILM
(FR) POUDRE POLYIMIDE, VERNIS DE POLYIMIDE ET FILM DE POLYIMIDE
(JA) ポリイミド粉体、ポリイミドワニス及びポリイミドフィルム
Abstract:
(EN) A polyimide powder which is composed of a blend of a polyimide powder A and a polyimide powder B and is soluble in an organic solvent, and which is characterized in that: the polyimide powder A and the polyimide powder B are composed of polyimides which have a structural unit that is derived from at least one aromatic diamine compound and a structural unit that is derived from at least one tetracarboxylic acid dianhydride; the polyimide powder A is composed of a polyimide which has (a-1) a reduced viscosity of 1.2 dL/g or more but less than 2.1 dL/g or (a-2) a weight average molecular weight of 100,000 g/mol or more but less than 250,000 g/mol; the polyimide powder B is composed of a polyimide which has (b-1) a reduced viscosity of from 2.1 dL/g to 3.0 dL/g (inclusive) or (b-2) a weight average molecular weight of from 250,000 g/mol to 500,000 g/mol (inclusive); the weight ratio of the polyimide powder A to the polyimide powder B is within the range of from 10/90 to 90/10; and a blend of the polyimide powder A and the polyimide powder B has a reduced viscosity within the range of from 1.7 dL/g to 2.5 dL/g, or a blend of the polyimide powder A and the polyimide powder B has a weight average molecular weight within the range of from 160,000 g/mol to 350,000 g/mol. This polyimide powder is soluble in an organic solvent, while having excellent handling properties. A varnish which is obtained by dissolving this polyimide powder into an organic solvent at a predetermined concentration forms a polyimide film that exhibits excellent heat resistance, transparency and mechanical characteristics.
(FR) La présente invention concerne une poudre de polyimide qui est composée d'un mélange d'une poudre de polyimide A et d'une poudre de polyimide B et est soluble dans un solvant organique, et qui est caractérisée en ce que : la poudre de polyimide A et la poudre de polyimide B sont composées de polyimides comportant un motif structural qui est dérivé d'au moins un composé de diamine aromatique et un motif structural qui est dérivé d'au moins un dianhydride d'acide tétracarboxylique ; la poudre de polyimide A est composée d'un polyimide qui a (a-1) une viscosité réduite de 1,2 dL/g ou plus mais inférieure à 2,1 dL/g ou (a-2) une masse moléculaire moyenne en poids de 100 000 g/mol ou plus mais inférieure à 250 000 g/mol ; la poudre de polyimide B est composée d'un polyimide qui a (b-1) une viscosité réduite de 2,1 dL/g à 3,0 dL/g (inclus) ou (b-2) une masse moléculaire moyenne en poids de 250 000 g/mol à 500 000 g/mol (inclus) ; le rapport massique de la poudre de polyimide A sur la poudre de polyimide B est dans la plage allant de 10/90 à 90/10 ; et un mélange de la poudre de polyimide A et de la poudre de polyimide B présente une viscosité réduite dans la plage allant de 1,7 dL/g à 2,5 dL/g, ou un mélange de la poudre de polyimide A et de la poudre de polyimide B a une masse moléculaire moyenne en poids dans la plage allant de 160 000 g/mol à 350 000 g/mol. Cette poudre de polyimide est soluble dans un solvant organique, tout en ayant d'excellentes propriétés de manipulation. Un vernis qui est obtenu par dissolution de cette poudre de polyimide dans un solvant organique à une concentration prédéterminée forme un film de polyimide qui présente une excellente résistance à la chaleur, une excellente transparence et d’excellentes caractéristiques mécaniques.
(JA) ポリイミド粉体Aとポリイミド粉体Bとのブレンドからなり、有機溶媒に可溶なポリイミド粉体であって、ポリイミド粉体A及びポリイミド粉体Bはそれぞれ、少なくとも1種類の芳香族ジアミン化合物に由来する構造単位と少なくとも1種類のテトラカルボン酸二無水物に由来する構造単位を有するポリイミドからなり、ポリイミド粉体Aは(a-1)1.2dL/g以上2.1dL/g未満の還元粘度、又は(a-2)100,000g/mol以上250,000g/mol未満の重量平均分子量を有するポリイミドからなり、ポリイミド粉体Bは(b-1)2.1dL/g以上3.0dL/g以下の還元粘度、又は(b-2)250,000g/mol以上500,000g/mol以下の重量平均分子量を有するポリイミドからなり、ポリイミド粉体A/ポリイミド粉体Bの重量比は10/90~90/10の範囲であり、ポリイミド粉体Aとポリイミド粉体Bとのブレンドについて測定した還元粘度が1.7~2.5dL/gの範囲、又はポリイミド粉体Aとポリイミド粉体Bとのブレンドについて測定した重量平均分子量が160,000~350,000g/molの範囲であることを特徴とするポリイミド粉体は、有機溶媒に可溶でハンドリング性に優れ、かかるポリイミド粉体を所定の濃度で有機溶媒に溶解したワニスは、耐熱性、透明性及び機械特性に優れたポリイミドフィルムを与える。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)