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1. (WO2019065113) METHOD FOR MANUFACTURING CIRCUIT WIRING AND METHOD FOR MANUFACTURING TOUCH PANEL
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2019/065113 International Application No.: PCT/JP2018/032679
Publication Date: 04.04.2019 International Filing Date: 03.09.2018
IPC:
G03F 7/38 (2006.01) ,C08F 220/28 (2006.01) ,G03F 7/004 (2006.01) ,G03F 7/039 (2006.01) ,G06F 3/041 (2006.01) ,H05K 3/00 (2006.01) ,H05K 3/06 (2006.01)
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
26
Processing photosensitive materials; Apparatus therefor
38
Treatment before imagewise removal, e.g. prebaking
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
F
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
220
Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide, or nitrile thereof
02
Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
10
Esters
26
Esters containing oxygen in addition to the carboxy oxygen
28
containing no aromatic rings in the alcohol moiety
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
04
Chromates
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
039
Macromolecular compounds which are photodegradable, e.g. positive electron resists
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
F
ELECTRIC DIGITAL DATA PROCESSING
3
Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
01
Input arrangements or combined input and output arrangements for interaction between user and computer
03
Arrangements for converting the position or the displacement of a member into a coded form
041
Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
02
in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
06
the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Applicants:
富士フイルム株式会社 FUJIFILM CORPORATION [JP/JP]; 東京都港区西麻布2丁目26番30号 26-30, Nishiazabu 2-chome, Minato-ku, Tokyo 1068620, JP
Inventors:
片山 晃男 KATAYAMA, Akio; JP
漢那 慎一 KANNA, Shinichi; JP
Agent:
特許業務法人太陽国際特許事務所 TAIYO, NAKAJIMA & KATO; 東京都新宿区新宿4丁目3番17号 3-17, Shinjuku 4-chome, Shinjuku-ku, Tokyo 1600022, JP
Priority Data:
2017-19083229.09.2017JP
Title (EN) METHOD FOR MANUFACTURING CIRCUIT WIRING AND METHOD FOR MANUFACTURING TOUCH PANEL
(FR) PROCÉDÉ DE FABRICATION DE CÂBLAGE DE CIRCUIT ET PROCÉDÉ DE FABRICATION D'UN ÉCRAN TACTILE
(JA) 回路配線の製造方法及びタッチパネルの製造方法
Abstract:
(EN) A method for manufacturing circuit wiring and a method for manufacturing a touch panel comprise: a step of bonding a photosensitive resin layer to a substrate with the outermost layer of a photosensitive resin in contact with the substrate with an upper temporary support as a base, where the temporary support and the photosensitive resin layer are a part of a positive-type photosensitive transfer material; a step of exposing a pattern on the photosensitive resin layer after the bonding step; a step of heating a structure in which the exposed photosensitive resin layer and the substrate are bonded so that the temperature of the structure is between −30°C and +10°C relative to the glass transition temperature of a resin component contained in the photosensitive resin layer and exceeds 20°C; a step of forming a pattern by developing the photosensitive resin layer after the heating step; and a step of etching the substrate in a region where the pattern is not provided.
(FR) La présente invention concerne un procédé de fabrication de câblage de circuit et un procédé de fabrication d'un écran tactile qui comprennent : une étape consistant à lier une couche de résine photosensible à un substrat, la couche la plus externe d'une résine photosensible étant en contact avec le substrat et un support temporaire supérieur faisant office de base, le support temporaire et la couche de résine photosensible constituant une partie d'un matériau de transfert photosensible de type positif; une étape consistant à exposer un motif sur la couche de résine photosensible après l'étape de liaison; une étape consistant à chauffer une structure dans laquelle la couche de résine photosensible exposée et le substrat sont liés de telle sorte que la température de la structure se situe entre -30 °C et +10 °C par rapport à la température de transition vitreuse d'un composant de résine contenu dans la couche de résine photosensible et qu'elle est supérieure à 20 °C; une étape consistant à former un motif par développement de la couche de résine photosensible après l'étape de chauffage; et une étape consistant à graver le substrat dans une région où le motif n'est pas présent.
(JA) 基板に対し、仮支持体及び感光性樹脂層を有するポジ型感光性転写材料の上仮支持体を基準として感光性樹脂層側の最外層を上記基板に接触させて貼り合わせる工程と、上記貼り合わせる工程後の上記感光性樹脂層をパターン露光する工程と、上記パターン露光する工程後の上記感光性樹脂層と基板とが貼り合わされた構造体を、上記構造体の温度が、上記感光性樹脂層に含まれる樹脂成分のガラス転移温度に対し-30℃以上、+10℃以下の温度であり、かつ、20℃を超える温度となるように加熱する工程と、上記加熱する工程後の上記感光性樹脂層を現像してパターンを形成する工程と、上記パターンが配置されていない領域における上記基板をエッチング処理する工程と、を含む回路配線の製造方法及びタッチパネルの製造方法。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)