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1. (WO2019065065) SOLDERING SYSTEM AND SOLDERING METHOD
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2019/065065 International Application No.: PCT/JP2018/032135
Publication Date: 04.04.2019 International Filing Date: 30.08.2018
Chapter 2 Demand Filed: 11.01.2019
IPC:
B23K 1/005 (2006.01) ,B23K 1/00 (2006.01) ,B23K 31/02 (2006.01) ,H05K 3/34 (2006.01)
[IPC code unknown for B23K 1/05]
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1
Soldering, e.g. brazing, or unsoldering
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
31
Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/-B23K28/193
02
relating to soldering or welding
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
32
electrically connecting electric components or wires to printed circuits
34
by soldering
Applicants:
株式会社堀内電機製作所 HORIUCHI ELECTRONICS. CO., LTD [JP/JP]; 東京都大田区多摩川2丁目12番21号 2-12-21, Tamagawa, Ota-ku, Tokyo 1460095, JP
Inventors:
藤島 利輝 FUJISHIMA Toshiteru; JP
田玉 茂 TADAMA Shigeru; JP
小林 広宣 KOBAYASHI Hironobu; JP
Agent:
特許業務法人信友国際特許事務所 SHIN-YU INTERNATIONAL PATENT FIRM; 東京都渋谷区笹塚2-1-6 笹塚センタービル Sasazuka Center Bldg., 2-1-6, Sasazuka, Shibuya-ku, Tokyo 1510073, JP
Priority Data:
2017-18669127.09.2017JP
2018-12809105.07.2018JP
Title (EN) SOLDERING SYSTEM AND SOLDERING METHOD
(FR) SYSTÈME DE BRASAGE ET PROCÉDÉ DE BRASAGE
(JA) はんだ付けシステム及びはんだ付け方法
Abstract:
(EN) Provided are a soldering system and a soldering method, whereby solder can be uniformly spread on a to-be-soldered part without damaging a fine soldering target article, and an excellent solder can be achieved. Even after molten solder attaches to the to-be-soldered part, the molten solder is continuously heated by continuously irradiating the molten solder with a semiconductor laser. As a result of the above treatment, an alloy of the to-be-soldered part and the molten solder is formed, the molten solder sufficiently wets the to-be-soldered part, and the molten solder flows to the to-be-soldered part by means of a capillary action.
(FR) L'invention concerne un système de brasage et un procédé de brasage, la brasure pouvant être uniformément répartie sur une partie à braser sans endommager un article cible de brasage fin, et une excellente brasure pouvant être obtenue. Même après que la brasure fondue se fixe à la partie à braser, la brasure fondue est chauffée en continu par irradiation continue de la brasure fondue avec un laser à semi-conducteur. Suite au traitement ci-dessus, un alliage de la pièce à braser et de la brasure fondue est formé, la brasure fondue mouille suffisamment la pièce à braser, et la brasure fondue s'écoule vers la pièce à braser au moyen d'une action capillaire.
(JA) 微小なはんだ付け対象物品を損傷せず、はんだ付けの箇所に均等に広がり、良好なはんだ付けを完遂できる、はんだ付けシステム及びはんだ付け方法を提供する。 溶融はんだがはんだ付け箇所に付着した後も、なお半導体レーザを溶融はんだに照射し続けることで、溶融はんだに対する加熱を継続する。この処理により、はんだ付け箇所と溶融はんだとの合金が形成され、溶融はんだがはんだ付け箇所へ十分に濡れて、毛細管現象で溶融はんだがはんだ付け箇所に流れる。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)