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1. (WO2019065037) COMPONENT-EQUIPPED BODY AND ELECTRONIC APPARATUS
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Pub. No.: WO/2019/065037 International Application No.: PCT/JP2018/031563
Publication Date: 04.04.2019 International Filing Date: 27.08.2018
IPC:
H01L 23/40 (2006.01) ,H01L 23/36 (2006.01) ,H02K 11/30 (2016.01) ,H05K 7/06 (2006.01) ,H05K 7/20 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
40
Mountings or securing means for detachable cooling or heating arrangements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
[IPC code unknown for H02K 11/30]
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
02
Arrangements of circuit components or wiring on supporting structure
06
on insulating boards
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
20
Modifications to facilitate cooling, ventilating, or heating
Applicants:
KYB株式会社 KYB CORPORATION [JP/JP]; 東京都港区浜松町二丁目4番1号 世界貿易センタービル World Trade Center Bldg., 4-1, Hamamatsu-cho 2-chome, Minato-ku, Tokyo 1056111, JP
Inventors:
江口 悠 EGUCHI, Yuu; JP
Agent:
大森 純一 OMORI, Junichi; JP
Priority Data:
2017-18816828.09.2017JP
Title (EN) COMPONENT-EQUIPPED BODY AND ELECTRONIC APPARATUS
(FR) CORPS ÉQUIPÉ D'UN COMPOSANT ET APPAREIL ÉLECTRONIQUE
(JA) 部品実装体及び電子機器
Abstract:
(EN) [Problem] To provide: a component-equipped body that can prevent degradation of quality caused by deformation of a circuit board; and an electronic apparatus that comprises the component-equipped body. [Solution] The component-equipped body according to one embodiment of the present invention has a component mounting substrate, a connector component, and a heat sink. The component mounting substrate has a first surface and a second surface that is on the reverse side from the first surface. The connector component is provided upon the first surface. The heat sink faces the second surface and has a first pedestal part that contacts the second surface in an area that faces the connector component with the component mounting substrate therebetween.
(FR) Le problème décrit par la présente invention est de fournir : un corps équipé d'un composant qui peut empêcher la dégradation de la qualité provoquée par la déformation d'une carte de circuit imprimé; et un appareil électronique qui comprend le corps équipé d'un composant. La solution selon l'invention concerne le corps équipé d'un composant selon un mode de réalisation comprenant un substrat de montage de composant, un composant de connecteur et un dissipateur thermique. Le substrat de montage de composant présente une première surface et une seconde surface qui se trouve sur le coté inverse de la première surface. Le composant de connecteur est disposé sur la première surface. Le dissipateur thermique fait face à la seconde surface et comporte une première partie de socle qui vient en contact avec la seconde surface dans une zone qui fait face au composant de connecteur avec le substrat de montage de composant entre ceux-ci.
(JA) 【課題】回路基板の変形による品質の低下を防止することができる部品実装体及びこれを備えた電子機器を提供すること。 【解決手段】本発明の一形態に係る部品実装体は、部品実装基板と、コネクタ部品と、ヒートシンクとを有する。上記部品実装基板は、第1の面と、上記第1の面とは反対側の第2の面とを有する。上記コネクタ部品は、上記第1の面上に設けられる。上記ヒートシンクは、上記第2の面に対向し、上記部品実装基板を介して上記コネクタ部品と対向する領域内において、上記第2の面に当接する第1の台座部を有する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)