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1. (WO2019065036) COMPONENT-EQUIPPED BODY AND ELECTRONIC APPARATUS
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Pub. No.: WO/2019/065036 International Application No.: PCT/JP2018/031560
Publication Date: 04.04.2019 International Filing Date: 27.08.2018
IPC:
H01L 23/40 (2006.01) ,H01L 23/36 (2006.01) ,H02K 11/30 (2016.01) ,H05K 7/20 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
40
Mountings or securing means for detachable cooling or heating arrangements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
[IPC code unknown for H02K 11/30]
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
20
Modifications to facilitate cooling, ventilating, or heating
Applicants:
KYB株式会社 KYB CORPORATION [JP/JP]; 東京都港区浜松町二丁目4番1号 世界貿易センタービル World Trade Center Bldg., 4-1, Hamamatsu-cho 2-chome, Minato-ku, Tokyo 1056111, JP
Inventors:
江口 悠 EGUCHI, Yuu; JP
Agent:
大森 純一 OMORI, Junichi; JP
Priority Data:
2017-18816728.09.2017JP
Title (EN) COMPONENT-EQUIPPED BODY AND ELECTRONIC APPARATUS
(FR) CORPS ÉQUIPÉ D'UN COMPOSANT ET APPAREIL ÉLECTRONIQUE
(JA) 部品実装体及び電子機器
Abstract:
(EN) The component-equipped body according to one embodiment of the present invention has a component mounting substrate, a connector component, a heat sink, and a first screw part. The component mounting substrate has a first surface and a second surface that is on the reverse side from the first surface. The connector component is provided upon the first surface and has: a plurality of terminal fixing parts that fix terminals that extend in a uniaxial direction that is orthogonal to the first surface; and a base part that connects the plurality of terminal fixing parts and has an opening part. The heat sink faces the second surface and has a first screw seat that faces the base part in the uniaxial direction with the component mounting substrate therebetween. The first screw part is arranged inside the opening part and screws into the first screw seat with the component mounting substrate therebetween.
(FR) Selon un mode de réalisation, la présente invention concerne un corps équipé d'un composant comprenant un substrat de montage de composant, un composant connecteur, un dissipateur thermique et une première partie de vis. Le substrat de montage de composant comporte une première surface et une seconde surface située du côté opposé à la première surface. Le composant connecteur est disposé sur la première surface et comporte : une pluralité de parties de fixation de bornes qui fixent des bornes qui s'étendent dans une direction uni-axiale orthogonale à la première surface ; et une partie de base qui relie la pluralité de parties de fixation de bornes et qui comporte une partie d'ouverture. Le dissipateur thermique fait face à la seconde surface et comporte un premier logement de vis qui fait face à la partie de base dans la direction uni-axiale, le substrat de montage de composant se trouvant entre ces derniers. La première partie de vis est disposée à l'intérieur de la partie d'ouverture et se visse dans le premier logement de vis, le substrat de montage de composant se trouvant entre ces derniers.
(JA) 本発明の一形態に係る部品実装体は、部品実装基板と、コネクタ部品と、ヒートシンクと、第1のネジ部とを有する。上記部品実装基板は、第1の面と、上記第1の面とは反対側の第2の面とを有する。上記コネクタ部品は、上記第1の面と直交する一軸方向に延びる端子を固定する複数の端子固定部と、上記複数の端子固定部間を連結し、開口部を有するベース部とを有し、上記第1の面上に設けられる。上記ヒートシンクは、上記第2の面と対向し、上記部品実装基板を介して前記ベース部と前記一軸方向に対向する第1のネジ座を有する。上記第1のネジ部は、上記開口部内に配置され、上記部品実装基板を介して上記第1のネジ座に螺合する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)