Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2019065003) LASER IRRADIATION DEVICE, LASER IRRADIATION METHOD AND PROJECTION MASK
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/065003 International Application No.: PCT/JP2018/030866
Publication Date: 04.04.2019 International Filing Date: 21.08.2018
IPC:
H01L 21/268 (2006.01) ,H01L 21/20 (2006.01) ,H01L 21/336 (2006.01) ,H01L 29/786 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
26
Bombardment with wave or particle radiation
263
with high-energy radiation
268
using electromagnetic radiation, e.g. laser radiation
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
20
Deposition of semiconductor materials on a substrate, e.g. epitaxial growth
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
334
Multistep processes for the manufacture of devices of the unipolar type
335
Field-effect transistors
336
with an insulated gate
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
29
Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having at least one potential-jump barrier or surface barrier; Capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof
66
Types of semiconductor device
68
controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified, or switched
76
Unipolar devices
772
Field-effect transistors
78
with field effect produced by an insulated gate
786
Thin-film transistors
Applicants:
株式会社ブイ・テクノロジー V TECHNOLOGY CO., LTD. [JP/JP]; 神奈川県横浜市保土ヶ谷区神戸町134番地 134, Godo-cho, Hodogaya-ku, Yokohama-shi, Kanagawa 2400005, JP
Inventors:
水村 通伸 MIZUMURA Michinobu; JP
Agent:
特許業務法人白坂 SHIRASAKA & PATENT PARTNERS; 東京都千代田区丸の内一丁目5番1号 新丸の内ビルディング10階EGG JAPAN EGG JAPAN 10F Shin-Marunouchi Building, 1-5-1 Marunouchi, Chiyoda-ku, Tokyo 1006510, JP
Priority Data:
2017-18549726.09.2017JP
Title (EN) LASER IRRADIATION DEVICE, LASER IRRADIATION METHOD AND PROJECTION MASK
(FR) DISPOSITIF D'IRRADIATION PAR LASER, PROCÉDÉ D'IRRADIATION PAR LASER ET MASQUE DE PROJECTION
(JA) レーザ照射装置、レーザ照射方法及び投影マスク
Abstract:
(EN) In one embodiment of the present invention, the laser irradiation device is characterized by comprising a light source that generates laser light, a projection lens that irradiates the laser light onto predetermined regions of a thin amorphous silicon film deposited on a substrate, and a projection mask pattern provided above the projection lens having a plurality of openings that allow the laser light to be irradiated onto the predetermined regions of the thin amorphous silicon film, wherein each of the plurality of openings have a transmittance based on the projection magnification of the projection lens.
(FR) Selon un mode de réalisation de la présente invention, le dispositif d'irradiation par laser est caractérisé en ce qu'il comprend une source de lumière qui génère une lumière laser, un objectif de projection qui projette la lumière laser sur des régions prédéterminées d'un film de silicium amorphe mince, déposé sur un substrat, et un motif de masque de projection disposé au-dessus de l'objectif de projection ayant plusieurs ouvertures qui permettent à la lumière laser d'être projetée sur les régions prédéterminées du film de silicium amorphe mince, chacune des ouvertures ayant un facteur de transmission fondé sur le grossissement de projection de l'objectif de projection.
(JA) 本発明の一実施形態におけるレーザ照射装置は、レーザ光を発生する光源と、基板上に被着されたアモルファスシリコン薄膜の所定の領域に、前記レーザ光を照射する投影レンズと、前記投影レンズ上に設けられ、前記アモルファスシリコン薄膜の所定の領域に対して前記レーザ光が照射されるように、複数の開口部が設けられた投影マスクパターンと、を備え、前記複数の開口部の各々は、前記投影レンズの投影倍率に基づく透過率を有することを特徴とする。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)