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1. (WO2019064976) PHOTOSENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD AND METHOD FOR PRODUCING ELECTRONIC DEVICE
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Pub. No.: WO/2019/064976 International Application No.: PCT/JP2018/030295
Publication Date: 04.04.2019 International Filing Date: 14.08.2018
IPC:
G03F 7/039 (2006.01) ,C08F 20/00 (2006.01) ,G03F 7/004 (2006.01) ,G03F 7/038 (2006.01) ,G03F 7/20 (2006.01)
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
039
Macromolecular compounds which are photodegradable, e.g. positive electron resists
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
F
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
20
Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide, or nitrile thereof
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
04
Chromates
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
038
Macromolecular compounds which are rendered insoluble or differentially wettable
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20
Exposure; Apparatus therefor
Applicants:
富士フイルム株式会社 FUJIFILM CORPORATION [JP/JP]; 東京都港区西麻布2丁目26番30号 26-30, Nishiazabu 2-chome, Minato-ku, Tokyo 1068620, JP
Inventors:
丹呉 直紘 TANGO Naohiro; JP
後藤 研由 GOTO Akiyoshi; JP
王 惠瑜 O Keiyu; JP
丸茂 和博 MARUMO Kazuhiro; JP
西尾 亮 NISHIO Ryo; JP
▲高▼田 暁 TAKADA Akira; JP
Agent:
中島 順子 NAKASHIMA Junko; JP
米倉 潤造 YONEKURA Junzo; JP
村上 泰規 MURAKAMI Yasunori; JP
Priority Data:
2017-19083429.09.2017JP
Title (EN) PHOTOSENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD AND METHOD FOR PRODUCING ELECTRONIC DEVICE
(FR) COMPOSITION DE RÉSINE PHOTOSENSIBLE, FILM DE RÉSERVE, PROCÉDÉ DE FORMATION DE MOTIFS ET PROCÉDÉ DE PRODUCTION D'UN DISPOSITIF ÉLECTRONIQUE
(JA) 感光性樹脂組成物、レジスト膜、パターン形成方法及び電子デバイスの製造方法
Abstract:
(EN) Provided are: a photosensitive resin composition from which a pattern that has an excellent shape is able to be obtained; a resist film which is a solidified product of this photosensitive resin composition; a pattern forming method which uses this resist film; and a method for producing an electronic device, which uses this resist film. This photosensitive resin composition contains a resin, a photoacid generator, a solvent and a low-molecular-weight ester compound; and the low-molecular-weight ester compound has alkali degradability, while having a molecular weight of less than 1,500. The content of the low-molecular-weight ester compound is from 0.1% by mass to 6% by mass (inclusive) relative to the total solid content of the composition.
(FR) L'invention concerne : une composition de résine photosensible à partir de laquelle un motif possédant une excellente forme peut être obtenu ; un film de réserve qui constitue un produit solidifié de cette composition de résine photosensible ; un procédé de formation de motifs qui utilise ce film de réserve ; et un procédé de production d'un dispositif électronique qui utilise également ce film de réserve. Cette composition de résine photosensible contient une résine, un générateur photoacide, un solvant et un composé ester à faible poids moléculaire ; et le composé ester à faible poids moléculaire possède une dégradabilité alcaline tout en ayant un poids moléculaire inférieur à 1500. La teneur du composé ester à faible poids moléculaire est de 0,1 % en masse à 6 % en masse (inclusivement) relativement à la teneur totale en solides de la composition.
(JA) 得られるパターンの形状に優れる感光性樹脂組成物、上記感光性樹脂組成物の固化物であるレジスト膜、上記レジスト膜によるパターン形成方法、及び、上記レジスト膜による電子デバイスの製造方法を提供する。感光性樹脂組成物は、樹脂と、光酸発生剤と、溶剤と、低分子エステル化合物と、を含み、上記低分子エステル化合物が、アルカリ分解性を有し、かつ、分子量が1,500未満であり、上記低分子エステル化合物の含有量が、組成物の全固形分に対し、0.1質量%以上6質量%以下である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)