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1. (WO2019064961) PHOTOSENSITIVE RESIN COMPOSITION, RESIST FILM, METHOD FOR FORMING PATTERN, AND METHOD FOR PRODUCING ELECTRONIC DEVICE
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Pub. No.: WO/2019/064961 International Application No.: PCT/JP2018/030050
Publication Date: 04.04.2019 International Filing Date: 10.08.2018
IPC:
G03F 7/004 (2006.01) ,C07D 263/56 (2006.01) ,C07D 263/57 (2006.01) ,C07D 263/60 (2006.01) ,C07D 277/62 (2006.01) ,C07D 277/66 (2006.01) ,C07D 277/84 (2006.01) ,C08F 20/10 (2006.01) ,G03F 7/039 (2006.01) ,G03F 7/20 (2006.01)
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
04
Chromates
C CHEMISTRY; METALLURGY
07
ORGANIC CHEMISTRY
D
HETEROCYCLIC COMPOUNDS
263
Heterocyclic compounds containing 1,3-oxazole or hydrogenated 1,3-oxazole rings
52
condensed with carbocyclic rings or ring systems
54
Benzoxazoles; Hydrogenated benzoxazoles
56
with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached in position 2
C CHEMISTRY; METALLURGY
07
ORGANIC CHEMISTRY
D
HETEROCYCLIC COMPOUNDS
263
Heterocyclic compounds containing 1,3-oxazole or hydrogenated 1,3-oxazole rings
52
condensed with carbocyclic rings or ring systems
54
Benzoxazoles; Hydrogenated benzoxazoles
56
with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached in position 2
57
Aryl or substituted aryl radicals
C CHEMISTRY; METALLURGY
07
ORGANIC CHEMISTRY
D
HETEROCYCLIC COMPOUNDS
263
Heterocyclic compounds containing 1,3-oxazole or hydrogenated 1,3-oxazole rings
52
condensed with carbocyclic rings or ring systems
60
Naphthoxazoles; Hydrogenated naphthoxazoles
C CHEMISTRY; METALLURGY
07
ORGANIC CHEMISTRY
D
HETEROCYCLIC COMPOUNDS
277
Heterocyclic compounds containing 1,3-thiazole or hydrogenated 1,3-thiazole rings
60
condensed with carbocyclic rings or ring systems
62
Benzothiazoles
C CHEMISTRY; METALLURGY
07
ORGANIC CHEMISTRY
D
HETEROCYCLIC COMPOUNDS
277
Heterocyclic compounds containing 1,3-thiazole or hydrogenated 1,3-thiazole rings
60
condensed with carbocyclic rings or ring systems
62
Benzothiazoles
64
with only hydrocarbon or substituted hydrocarbon radicals attached in position 2
66
with aromatic rings or ring systems directly attached in position 2
C CHEMISTRY; METALLURGY
07
ORGANIC CHEMISTRY
D
HETEROCYCLIC COMPOUNDS
277
Heterocyclic compounds containing 1,3-thiazole or hydrogenated 1,3-thiazole rings
60
condensed with carbocyclic rings or ring systems
84
Naphthothiazoles
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
F
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
20
Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide, or nitrile thereof
02
Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
10
Esters
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
039
Macromolecular compounds which are photodegradable, e.g. positive electron resists
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20
Exposure; Apparatus therefor
Applicants:
富士フイルム株式会社 FUJIFILM CORPORATION [JP/JP]; 東京都港区西麻布2丁目26番30号 26-30, Nishiazabu 2-chome, Minato-ku, Tokyo 1068620, JP
Inventors:
丸茂 和博 MARUMO Kazuhiro; JP
丹呉 直紘 TANGO Naohiro; JP
西尾 亮 NISHIO Ryo; JP
▲高▼田 暁 TAKADA Akira; JP
Agent:
中島 順子 NAKASHIMA Junko; JP
米倉 潤造 YONEKURA Junzo; JP
村上 泰規 MURAKAMI Yasunori; JP
Priority Data:
2017-19083529.09.2017JP
Title (EN) PHOTOSENSITIVE RESIN COMPOSITION, RESIST FILM, METHOD FOR FORMING PATTERN, AND METHOD FOR PRODUCING ELECTRONIC DEVICE
(FR) COMPOSITION DE RÉSINE PHOTOSENSIBLE, FILM DE RÉSERVE, PROCÉDÉ DE FORMATION DE MOTIF ET PROCÉDÉ DE PRODUCTION DE DISPOSITIF ÉLECTRONIQUE
(JA) 感光性樹脂組成物、レジスト膜、パターン形成方法及び電子デバイスの製造方法
Abstract:
(EN) Provided are: a photosensitive resin composition having high tolerance for focus depth in the formation of a punched pattern; a resist film which is a solidified product of the photosensitive resin composition; a method for forming a pattern using the resist film; and a method for producing an electronic device using the resist film. The photosensitive resin composition contains a resin having a constituent unit having an acid-degradable group, a photo-acid generator, a solvent and a compound represented by formula D. In formula D, XD represents an O atom or an S atom; R1D represents a hydrogen atom, a hydrocarbon group, an acyl group, an acyloxy group or an alkoxycarbonyl group; R2D represents a substituent; nD represents an integer of 0 to 4 inclusive; and at least two R2D's may be bound to each other to form a ring.
(FR) L'invention concerne : une composition de résine photosensible ayant une tolérance élevée à la profondeur de focalisation dans la formation d'un motif perforé ; un film de réserve qui est un produit solidifié de la composition de résine photosensible ; un procédé de formation d'un motif à l'aide du film de réserve ; et un procédé de production d'un dispositif électronique à l'aide du film de réserve. La composition de résine photosensible contient une résine présentant un motif constitutif ayant un groupe dégradable par un acide, un générateur de photo-acide, un solvant et un composé représenté par la formule D. Dans la formule D, XD représente un atome O ou un atome S ; R1D représente un atome d'hydrogène, un groupe hydrocarboné, un groupe acyle, un groupe acyloxy ou un groupe alcoxycarbonyle ; R2D représente un substituant ; nD représente un nombre entier allant de 0 à 4 inclus ; et au moins deux R2D peuvent être liés l'un à l'autre afin de former un cycle.
(JA) 抜きパターンの形成時における焦点深度の許容度が大きい感光性樹脂組成物、上記感光性樹脂組成物の固化物であるレジスト膜、上記レジスト膜によるパターン形成方法、及び、上記レジスト膜による電子デバイスの製造方法を提供する。感光性樹脂組成物は、酸分解性基を有する構成単位を有する樹脂、光酸発生剤、溶剤、及び、式Dで表される化合物を含む。式D中、XはO原子又はS原子を表し、R1Dは水素原子、炭化水素基、アシル基、アシルオキシ基又はアルコキシカルボニル基を表し、R2Dは、置換基を表し、nDは0以上4以下の整数を表し、2以上のR2Dが結合して環を形成していてもよい。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)