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1. (WO2019064904) SEMICONDUCTOR MODULE
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Pub. No.: WO/2019/064904 International Application No.: PCT/JP2018/028790
Publication Date: 04.04.2019 International Filing Date: 01.08.2018
IPC:
H01L 23/50 (2006.01) ,H01L 23/48 (2006.01) ,H01L 25/07 (2006.01) ,H01L 25/18 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
50
for integrated circuit devices
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
07
the devices being of a type provided for in group H01L29/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
18
the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/-H01L51/160
Applicants:
株式会社デンソー DENSO CORPORATION [JP/JP]; 愛知県刈谷市昭和町1丁目1番地 1-1, Showa-cho, Kariya-city Aichi 4488661, JP
Inventors:
岩出 知生 IWADE Tomoo; JP
福岡 大輔 FUKUOKA Daisuke; JP
Agent:
金 順姫 JIN Shunji; JP
Priority Data:
2017-18864728.09.2017JP
Title (EN) SEMICONDUCTOR MODULE
(FR) MODULE SEMI-CONDUCTEUR
(JA) 半導体モジュール
Abstract:
(EN) This semiconductor module (10) comprises a seal resin body (13) sealing a plurality of semiconductor elements (11H, 11L) constituting upper and lower arms, a power source terminal (22) having a positive electrode side terminal (22p) and a negative electrode side terminal (22n), and an output terminal (23). The power source terminal and the output terminal protrude from the same lateral surface (13c) of the seal resin body. The respective protruding sections from the positive electrode side terminal, the negative electrode side terminal, and the output terminal, are disposed aligned in such a manner that the output terminal is disposed at one end. In addition, the power source terminal disposed at the opposite end from the output terminal has a protrusion length that is shorter than the protrusion length of the power source terminal disposed in the middle. In this manner, a bus bar that runs to the power source terminal disposed in the middle can be extended in the alignment direction without having to be disposed in such a manner as to avoid the power source terminal at the end.
(FR) Ce module semi-conducteur (10) comprend un corps en résine d'étanchéité (13) scellant une pluralité d'éléments semi-conducteurs (11H, 11L) constituant des bras supérieur et inférieur, une borne de bloc d'alimentation (22) ayant une borne côté électrode positive (22p) et une borne côté électrode négative (22n), et une borne de sortie (23). La borne de bloc d'alimentation et la borne de sortie font saillie à partir de la même surface latérale (13c) du corps en résine d'étanchéité. Les sections en saillie respectives à partir de la borne côté électrode positive, de la borne côté électrode négative et de la borne de sortie, sont disposées alignées de telle sorte que la borne de sortie est disposée à une extrémité. De plus, la borne de bloc d'alimentation disposée au niveau de l'extrémité opposée de la borne de sortie a une longueur de saillie qui est plus courte que la longueur de saillie de la borne de bloc d'alimentation disposée au centre. De cette manière, une barre omnibus qui s'étend jusqu'à la borne de bloc d'alimentation disposée au centre peut s'étendre dans la direction d'alignement sans avoir à être disposée de manière à éviter la borne de bloc d'alimentation au niveau de l'extrémité.
(JA) 半導体モジュール(10)は、上下アームを構成する複数の半導体素子(11H,11L)を封止する封止樹脂体(13)と、正極側端子(22p)及び負極側端子(22n)を有する電源端子(22)と、出力端子(23)を備えている。電源端子及び出力端子は、封止樹脂体の同じ側面(13c)から突出している。正極側端子、負極側端子、及び出力端子それぞれの突出部分は、出力端子が一方の端部に配置されるように、並んで配置されている。そして、出力端子とは反対の端部に配置された電源端子の突出長さが、真ん中に配置された電源端子の突出長さよりも短くされている。これにより、真ん中に配置された電源端子に連なるバスバーを、端部の電源端子を避けるように配置しなくても、並び方向に延設させることができる。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)