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1. (WO2019064887) PHYSICAL QUANTITY DETECTION DEVICE
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Pub. No.: WO/2019/064887 International Application No.: PCT/JP2018/028386
Publication Date: 04.04.2019 International Filing Date: 30.07.2018
IPC:
G01F 1/684 (2006.01) ,G01K 1/14 (2006.01) ,G01K 13/02 (2006.01)
G PHYSICS
01
MEASURING; TESTING
F
MEASURING VOLUME, VOLUME FLOW, MASS FLOW, OR LIQUID LEVEL; METERING BY VOLUME
1
Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through the meter in a continuous flow
68
by using thermal effects
684
Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
G PHYSICS
01
MEASURING; TESTING
K
MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
1
Details of thermometers not specially adapted for particular types of thermometer
14
Supports; Fastening devices; Mounting thermometers in particular locations
G PHYSICS
01
MEASURING; TESTING
K
MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
13
Adaptations of thermometers for specific purposes
02
for measuring temperature of moving fluids or granular materials capable of flow
Applicants:
日立オートモティブシステムズ株式会社 HITACHI AUTOMOTIVE SYSTEMS, LTD. [JP/JP]; 茨城県ひたちなか市高場2520番地 2520, Takaba, Hitachinaka-shi, Ibaraki 3128503, JP
Inventors:
余語 孝之 YOGO Takayuki; JP
ファティン ファハナー ビンティ ハリダン FATIN FARHANAH, Binti Haridan; JP
上ノ段 暁 UENODAN Akira; JP
三木 崇裕 MIKI Takahiro; JP
星加 浩昭 HOSHIKA Hiroaki; JP
Agent:
戸田 裕二 TODA Yuji; JP
Priority Data:
2017-19223729.09.2017JP
Title (EN) PHYSICAL QUANTITY DETECTION DEVICE
(FR) DISPOSITIF DE DÉTECTION DE QUANTITÉ PHYSIQUE
(JA) 物理量検出装置
Abstract:
(EN) Provided is a physical quantity detection device capable of suppressing the influence of heat on a sensor resulting from size reduction. This physical quantity detection device 20 comprises a chip package 208 in which a flow sensor 205 and electronic component are sealed with resin and a circuit board 207 having the chip package 208 mounted thereon. The chip package 208 is fixed to the board surface of the circuit board 207 in a state in which a portion thereof protrudes laterally from an edge of the circuit board 207. The circuit board 207 has a flat margin area S on the board surface that is wider than the chip package 207 and is located at a position offset from the chip package 208 in the opposite direction from the protrusion direction.
(FR) L'invention concerne un dispositif de détection de quantité physique permettant de supprimer l'influence de la chaleur sur un capteur résultant d'une réduction de taille. Ledit dispositif de détection de quantité physique (20) comprend un boîtier de puce (208) dans lequel un capteur de flux (205) et un composant électronique sont scellés à l'aide d'une résine, et une carte de circuit imprimé (207) sur laquelle est monté le boîtier de puce (208). Le boîtier de puce (208) est fixé à la surface de la carte de circuit imprimé (207) dans un état dans lequel une partie de ce dernier fait saillie latéralement depuis un bord de la carte de circuit imprimé (207). La carte de circuit imprimé (207) présente une zone de marge plate (S) sur la surface de carte qui est plus large que le boîtier de puce (207) et est située à une position décalée par rapport au boîtier de puce (208) dans la direction opposée à la direction de saillie.
(JA) 小型化に起因するセンサへの熱影響を抑制することができる物理量検出装置を得ること。 本発明の物理量検出装置20は、流量センサ205と電子部品が樹脂で封止されているチップパッケージ208と、チップパッケージ208が実装される回路基板207を備えている。そして、チップパッケージ208は、その一部が回路基板207の端部から側方に突出した状態で回路基板207の基板面に固定されており、回路基板207は、基板面上の位置でかつチップパッケージ208よりも突出方向と反対の方向に偏倚した位置に、チップパッケージ207の幅よりも広い平坦な余白領域Sを有する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)