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1. (WO2019064871) STRUCTURE, WIRING BOARD, BASE MATERIAL FOR WIRING BOARDS, COPPER-CLAD LAMINATE, AND METHOD FOR PRODUCING STRUCTURE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2019/064871 International Application No.: PCT/JP2018/028119
Publication Date: 04.04.2019 International Filing Date: 26.07.2018
IPC:
B32B 27/00 (2006.01) ,C08J 7/00 (2006.01) ,C08J 7/02 (2006.01) ,H05K 1/02 (2006.01) ,H05K 1/03 (2006.01) ,H05K 3/14 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27
Layered products essentially comprising synthetic resin
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
7
Chemical treatment or coating of shaped articles made of macromolecular substances
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
7
Chemical treatment or coating of shaped articles made of macromolecular substances
02
with solvents, e.g. swelling agents
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
10
in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
14
using spraying techniques to apply the conductive material
Applicants:
株式会社 東芝 KABUSHIKI KAISHA TOSHIBA [JP/JP]; 東京都港区芝浦一丁目1番1号 1-1, Shibaura 1-chome, Minato-ku, Tokyo 1050023, JP
Inventors:
中島 元 NAKASHIMA, Hajime; JP
小松 出 KOMATSU, Izuru; JP
Agent:
蔵田 昌俊 KURATA, Masatoshi; JP
野河 信久 NOGAWA, Nobuhisa; JP
河野 直樹 KOHNO, Naoki; JP
Priority Data:
2017-18633227.09.2017JP
Title (EN) STRUCTURE, WIRING BOARD, BASE MATERIAL FOR WIRING BOARDS, COPPER-CLAD LAMINATE, AND METHOD FOR PRODUCING STRUCTURE
(FR) STRUCTURE, CARTE DE CÂBLAGE, MATÉRIAU DE BASE DE CARTES DE CÂBLAGE, STRATIFIÉ CUIVRÉ ET PROCÉDÉ DE PRODUCTION D'UNE STRUCTURE
(JA) 構造体、配線基板、配線基板用基材、銅張積層板及び構造体の製造方法
Abstract:
(EN) One embodiment of the present invention provides a structure. This structure is provided with a silicone molded article, water and a protective material. At least a part of the surface of the silicone molded article contains a hydroxyl group. The water is in contact with at least a part of the surface that contains a hydroxyl group. The protective material retains the water.
(FR) Selon un mode de réalisation, la présente invention concerne une structure. La structure est pourvue d'un article moulé en silicone, d'eau et d'un matériau protecteur. Au moins une partie de la surface de l'article moulé en silicone contient un groupe hydroxyle. L'eau est en contact avec au moins une partie de la surface qui contient un groupe hydroxyle. Le matériau protecteur retient l'eau.
(JA) 実施形態によると、構造体が提供される。構造体は、シリコーン成形品と、水と、保護材とを備えている。シリコーン成形品は、表面の少なくとも一部に水酸基を含んでいる。水は、水酸基を含む表面の少なくとも一部と接している。保護材は、水を保持している。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)