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1. (WO2019064516) ELECTRON BEAM APPARATUS, AND DEVICE MANUFACTURING METHOD
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Pub. No.: WO/2019/064516 International Application No.: PCT/JP2017/035568
Publication Date: 04.04.2019 International Filing Date: 29.09.2017
IPC:
H01L 21/027 (2006.01) ,G03F 7/20 (2006.01) ,H01J 37/305 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
027
Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L21/18 or H01L21/34165
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20
Exposure; Apparatus therefor
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
J
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37
Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
30
Electron-beam or ion-beam tubes for localised treatment of objects
305
for casting, melting, evaporating, or etching
Applicants:
株式会社ニコン NIKON CORPORATION [JP/JP]; 東京都港区港南二丁目15番3号 15-3, Konan 2-chome, Minato-ku, Tokyo 1086290, JP
Inventors:
佐藤 真路 SATO, Shinji; JP
Agent:
立石 篤司 TATEISHI, Atsuji; JP
Priority Data:
Title (EN) ELECTRON BEAM APPARATUS, AND DEVICE MANUFACTURING METHOD
(FR) APPAREIL DE FAISCEAU D'ÉLECTRONS ET PROCÉDÉ DE FABRICATION
(JA) 電子ビーム装置及びデバイス製造方法
Abstract:
(EN) An exposure device (1000) comprises: a light optical system (180i); a housing (19) that has formed, in the interior thereof, a vacuum space (34) in which an electron emission surface of a photoelectric element (54i) is positioned; a frame (17) that supports at least one section of the light optical system; an electron beam optical system (70i) that makes electrons into an electron beam and bombards a target (W) therewith, said electrons being produced from the photoelectric element (54i) due to irradiation with at least one light beam from the light optical system; and an adjustment apparatus that can adjust a relative positional relationship of the housing (19) and the frame (17).
(FR) La présente invention concerne un dispositif d'exposition (1000) comprenant : un système lumineux optique (180i) ; un boîtier (19) dans lequel est formé un espace sous vide (34) dans lequel une surface d'émission d'électrons d'un élément photoélectrique (54i) est positionnée ; un cadre (17) qui soutient au moins une partie du système lumineux optique ; un système optique à faisceau d'électrons (70i) qui transforme des électrons en un faisceau d'électrons et bombarde une cible (W) à l'aide de ce dernier, lesdits électrons étant produits à partir de l'élément photoélectrique (54i) en raison de l'exposition à au moins un faisceau lumineux provenant du système lumineux optique ; et un appareil de réglage qui peut ajuster une relation de position relative du boîtier (19) et du cadre (17).
(JA) 露光装置(1000)は、光光学系(180)と、光電素子(54)の電子放出面が配置される真空空間(34)が内部に形成される筐体(19)と、光光学系の少なくとも一部を支持するフレーム(17)と、光光学系からの少なくとも1つの光ビームの照射により光電素子(54)から発生する電子を電子ビームとしてターゲット(W)に照射する電子ビーム光学系(70)と、筐体(19)とフレーム(17)との相対的な位置関係を調整可能な調整装置と、を備える。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)