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1. (WO2019064384) SUBSTRATE TREATMENT APPARATUS, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND PROGRAM
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Pub. No.: WO/2019/064384 International Application No.: PCT/JP2017/035004
Publication Date: 04.04.2019 International Filing Date: 27.09.2017
IPC:
H01L 21/677 (2006.01) ,H01L 21/22 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
677
for conveying, e.g. between different work stations
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
22
Diffusion of impurity materials, e.g. doping materials, electrode materials, into, or out of, a semiconductor body, or between semiconductor regions; Redistribution of impurity materials, e.g. without introduction or removal of further dopant
Applicants:
株式会社KOKUSAI ELECTRIC KOKUSAI ELECTRIC CORPORATION [JP/JP]; 東京都千代田区神田鍛冶町三丁目4番地 3-4, Kandakaji-cho, Chiyoda-ku, TOKYO 1010045, JP
Inventors:
岡▲ざき▼ 正 OKAZAKI, Tadashi; JP
安彦 一 ABIKO, Hajime; JP
宮田 智之 MIYADA, Tomoyuki; JP
加我 友紀直 KAGA, Yukinao; JP
Priority Data:
Title (EN) SUBSTRATE TREATMENT APPARATUS, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND PROGRAM
(FR) APPAREIL DE TRAITEMENT DE SUBSTRAT, PROCÉDÉ DE FABRICATION DE DISPOSITIF À SEMI-CONDUCTEURS, ET SUPPORT D'ENREGISTREMENT
(JA) 基板処理装置、半導体装置の製造方法及びプログラム
Abstract:
(EN) The present invention is configured to be provided with: a substrate holding tool for holding a variety of multiple substrates including a product substrate and a dummy substrate; a transfer mechanism for loading the variety of substrates to the substrate holding tool; and a control unit that acquires the number of substrates which can be mounted on the substrate holding tool and the number of product substrates to be mounted on the substrate holding tool, divides the product substrates into multiple substrate groups according to the acquired number of product substrates, divides dummy substrates into multiple substrate groups on the basis of the acquired number of product substrates, the number of substrates that can be mounted on the substrate holding tool, and the number of substrate groups of the product substrates, creates substrate arrangement data used when mounting the product substrates on multiple regions of the substrate holding tool in a dispersed manner, by combining the substrate groups of the product substrate and the substrate groups of the dummy substrates, and causes the transfer mechanism to transfer the variety of substrates to the substrate holding tool according to the created substrate arrangement data.
(FR) La présente invention est configurée pour comprendre: un outil de maintien de substrat pour maintenir une variété de substrats multiples comprenant un substrat de produit et un substrat factice; un mécanisme de transfert pour charger la variété de substrats sur l'outil de maintien de substrat; et une unité de commande qui acquiert le nombre de substrats qui peuvent être montés sur l'outil de maintien de substrat et le nombre de substrats de produit à monter sur l'outil de maintien de substrat, divise les substrats de produit en de multiples groupes de substrats en fonction du nombre acquis de substrats de produit, divise des substrats factices en de multiples groupes de substrats sur la base du nombre acquis de substrats de produit, du nombre de substrats qui peuvent être montés sur l'outil de maintien de substrat, et du nombre de groupes de substrats des substrats de produit, crée des données d'agencement de substrat utilisées lors du montage des substrats de produit sur de multiples régions de l'outil de maintien de substrat d'une manière dispersée, en combinant les groupes de substrats du substrat de produit et les groupes de substrats des substrats factices, et amène le mécanisme de transfert à transférer la variété de substrats vers l'outil de maintien de substrat en fonction des données d'agencement de substrat créées.
(JA) 製品基板とダミー基板を含む複数枚の各種基板を保持する基板保持具と、各種基板を基板保持具に装填する移載機構と、該基板保持具に載置可能な基板枚数と、該基板保持具に載置される製品基板の枚数とを取得し、取得した製品基板の枚数から製品基板を複数の基板群に分割し、取得した製品基板の枚数と基板保持具に載置可能な基板枚数、及び製品基板の基板群の数に基づいてダミー基板を複数の基板群に分割し、該製品基板の基板群と該ダミー基板の基板群を組合せて、基板保持具の複数の領域に製品基板を分散させて載置する基板配置データを作成し、作成された基板配置データに応じて、各種基板を移載機構に基板保持具に移載させる制御部と、を備えた構成が提供される。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)