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1. (WO2019064357) DISPLAY DEVICE PRODUCTION METHOD
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Pub. No.: WO/2019/064357 International Application No.: PCT/JP2017/034817
Publication Date: 04.04.2019 International Filing Date: 26.09.2017
IPC:
H05B 33/10 (2006.01) ,G09F 9/30 (2006.01) ,H01L 27/32 (2006.01) ,H01L 51/50 (2006.01) ,H05B 33/02 (2006.01) ,H05B 33/04 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
10
Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
G PHYSICS
09
EDUCATING; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
F
DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9
Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30
in which the desired character or characters are formed by combining individual elements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28
including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32
with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
02
Details
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
02
Details
04
Sealing arrangements
Applicants:
シャープ株式会社 SHARP KABUSHIKI KAISHA [JP/JP]; 大阪府堺市堺区匠町1番地 1, Takumi-cho, Sakai-ku, Sakai City, Osaka 5908522, JP
Inventors:
松井 章宏 MATSUI Akihiro; --
高橋 純平 TAKAHASHI Jumpei; --
妹尾 亨 SENOO Tohru; --
平瀬 剛 HIRASE Takeshi; --
園田 通 SONODA Tohru; --
越智 貴志 OCHI Takashi; --
越智 久雄 OCHI Hisao; --
Agent:
特許業務法人前田特許事務所 MAEDA & PARTNERS; 大阪府大阪市北区堂島浜1丁目2番1号 新ダイビル23階 Shin-Daibiru Bldg. 23F, 2-1, Dojimahama 1-chome, Kita-ku, Osaka-shi, Osaka 5300004, JP
Priority Data:
Title (EN) DISPLAY DEVICE PRODUCTION METHOD
(FR) PROCÉDÉ DE PRODUCTION DE DISPOSITIF D'AFFICHAGE
(JA) 表示装置の製造方法
Abstract:
(EN) This organic EL display device (1) production method includes a seal film forming step of forming a seal film (25) in such a manner as to cover an organic EL element (18), the seal film forming step comprising: the step of forming a first inorganic layer (19) in such a manner as to cover the organic EL element (18); the step of forming separation walls (30) above the first inorganic layer (19); the step of coating, within the separation walls (30), an organic material on the surface of the first inorganic layer (19), thereby forming an organic layer (20) on the first inorganic layer (19); the step of removing the separation walls (30); and the step of forming a second inorganic layer (21) above the first inorganic layer (19), in such a manner as to cover the organic layer (20).
(FR) Ce procédé de production de dispositif d'affichage électroluminescent organique (1) comprend une étape de formation de film d'étanchéité consistant à former un film d'étanchéité (25) de manière à recouvrir un élément électroluminescent organique (18), l'étape de formation de film d'étanchéité comprenant : l'étape de formation d'une première couche inorganique (19) de manière à recouvrir l'élément électroluminescent organique (18) ; l'étape de formation de cloisons (30) au-dessus de la première couche inorganique (19) ; l'étape de revêtement, à l'intérieur des cloisons (30), d'un matériau organique sur la surface de la première couche inorganique (19), formant ainsi une couche organique (20) sur la première couche inorganique (19) ; l'étape de retrait des cloisons (30) ; et l'étape de formation d'une seconde couche inorganique (21) au-dessus de la première couche inorganique (19), de manière à recouvrir la couche organique (20).
(JA) 有機EL素子(18)を覆うように封止膜(25)を形成する封止膜形成工程を備える有機EL表示装置(1)の製造方法であって、封止膜形成工程は、有機EL素子(18)を覆うように第1無機層(19)を形成する工程と、第1無機層(19)上に隔壁(30)を形成する工程と、隔壁(30)の内側であって、第1無機層(19)の表面上に有機材料を塗布することにより、第1無機層(19)上に有機層(20)を形成する工程と、隔壁(30)を除去する工程と、第1無機層(19)上に、有機層(20)を覆うように第2無機層(21)を形成する工程とを備える。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)