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1. (WO2019064342) DISPLAY DEVICE, METHOD FOR MANUFACTURING DISPLAY DEVICE, AND APPARATUS FOR MANUFACTURING DISPLAY DEVICE
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Pub. No.: WO/2019/064342 International Application No.: PCT/JP2017/034737
Publication Date: 04.04.2019 International Filing Date: 26.09.2017
IPC:
H01L 51/50 (2006.01) ,G09F 9/30 (2006.01) ,H01L 27/32 (2006.01) ,H05B 33/10 (2006.01) ,H05B 33/12 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
G PHYSICS
09
EDUCATING; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
F
DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9
Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30
in which the desired character or characters are formed by combining individual elements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28
including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32
with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
10
Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
12
Light sources with substantially two-dimensional radiating surfaces
Applicants:
シャープ株式会社 SHARP KABUSHIKI KAISHA [JP/JP]; 大阪府堺市堺区匠町1番地 1, Takumi-cho, Sakai-ku, Sakai City, Osaka 5908522, JP
Inventors:
三谷 昌弘 MITANI, Masahiro; --
Agent:
特許業務法人HARAKENZO WORLD PATENT & TRADEMARK HARAKENZO WORLD PATENT & TRADEMARK; 大阪府大阪市北区天神橋2丁目北2番6号 大和南森町ビル Daiwa Minamimorimachi Building, 2-6, Tenjinbashi 2-chome Kita, Kita-ku, Osaka-shi, Osaka 5300041, JP
Priority Data:
Title (EN) DISPLAY DEVICE, METHOD FOR MANUFACTURING DISPLAY DEVICE, AND APPARATUS FOR MANUFACTURING DISPLAY DEVICE
(FR) DISPOSITIF D'AFFICHAGE, PROCÉDÉ DE FABRICATION D'UN DISPOSITIF D'AFFICHAGE ET APPAREIL DE FABRICATION D'UN DISPOSITIF D'AFFICHAGE
(JA) 表示デバイス、表示デバイスの製造方法、表示デバイスの製造装置
Abstract:
(EN) An active-side slit (43) and an FPC-side slit (44) reach a first inorganic insulating film (18) by penetrating a second inorganic insulating film (20). In a plan view, the active-side slit (43) is formed between an IC chip mounting region (56) and an active region of an EL device (2), and the IC chip mounting region (56) is sandwiched between the active-side slit (43) and the FPC-side slit (44).
(FR) La présente invention concerne une fente côté actif (43) et une fente côté FPC (44) qui atteignent un premier film isolant inorganique (18) par pénétration d'un second film isolant inorganique (20). Dans une vue en plan, la fente côté actif (43) est formée entre une région de montage de puce CI (56) et une région active d'un dispositif EL (2), et la région de montage de puce CI (56) est prise en sandwich entre la fente côté actif (43) et la fente côté FPC (44).
(JA) アクティブ側スリット(43)およびFPC側スリット(44)は、各々、第2無機絶縁膜(20)を貫通して第1無機絶縁膜(18)に達している。平面視においては、アクティブ側スリット(43)が、ELデバイス(2)のアクティブ領域とICチップ搭載領域(56)との間に形成されるとともに、ICチップ搭載領域(56)は、アクティブ側スリット(43)およびFPC側スリット(44)によって挟まれている。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)