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1. (WO2019064341) APPLYING DEVICE WITH REPAIR FUNCTION, AND COMPONENT MOUNTING SYSTEM
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Pub. No.: WO/2019/064341 International Application No.: PCT/JP2017/034735
Publication Date: 04.04.2019 International Filing Date: 26.09.2017
Chapter 2 Demand Filed: 08.03.2018
IPC:
H05K 3/34 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
32
electrically connecting electric components or wires to printed circuits
34
by soldering
Applicants:
ヤマハ発動機株式会社 YAMAHA HATSUDOKI KABUSHIKI KAISHA [JP/JP]; 静岡県磐田市新貝2500番地 2500 Shingai, Iwata-shi, Shizuoka 4388501, JP
Inventors:
鈴木 直樹 SUZUKI, Naoki; JP
Agent:
宮園 博一 MIYAZONO, Hirokazu; JP
Priority Data:
Title (EN) APPLYING DEVICE WITH REPAIR FUNCTION, AND COMPONENT MOUNTING SYSTEM
(FR) DISPOSITIF D'APPLICATION AVEC FONCTION DE RÉPARATION, ET SYSTÈME DE MONTAGE DE COMPOSANT
(JA) 補修機能付き塗布装置および部品実装システム
Abstract:
(EN) This applying device (1) with a repair function is provided with: an applying part (41) that applies a liquid material (S) to a substrate (B); and a control part (8) that performs a control for repairing by applying the liquid material (S) using the applying part when the amount of the applied or printed liquid material is insufficient in a predetermined location (RA) on the substrate.
(FR) Selon l'invention, ue dispositif d'application (1) avec fonction de réparation comporte : un module applicateur (41) qui applique un matériau liquide (S) sur un substrat (B); et un module de commande (8) qui commande une réparation par application du matériau liquide (S) au moyen du module applicateur lorsque la quantité du matériau liquide appliquée ou imprimée est insuffisante à un emplacement prédéterminé (RA) du substrat.
(JA) この補修機能付き塗布装置(1)は、液材(S)を基板(B)に塗布する塗布部(41)と、基板上の所定箇所(RA)に塗布または印刷された液材の量が不足している場合に、塗布部により液材を塗布して補修する制御を行う制御部(8)とを備えている。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)