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1. (WO2019064325) LASER PROCESSING METHOD AND LASER PROCESSING DEVICE
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Pub. No.: WO/2019/064325 International Application No.: PCT/JP2017/034650
Publication Date: 04.04.2019 International Filing Date: 26.09.2017
IPC:
B23K 26/064 (2014.01) ,B23K 26/0622 (2014.01)
[IPC code unknown for B23K 26/064][IPC code unknown for B23K 26/0622]
Applicants:
三菱電機株式会社 MITSUBISHI ELECTRIC CORPORATION [JP/JP]; 東京都千代田区丸の内二丁目7番3号 7-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1008310, JP
Inventors:
黒崎 芳晴 KUROSAKI, Yoshiharu; JP
山本 達也 YAMAMOTO, Tatsuya; JP
石川 恭平 ISHIKAWA, Kyohei; JP
佐伯 政之 SAIKI, Masayuki; JP
Agent:
高村 順 TAKAMURA, Jun; JP
Priority Data:
Title (EN) LASER PROCESSING METHOD AND LASER PROCESSING DEVICE
(FR) PROCÉDÉ DE TRAITEMENT LASER ET DISPOSITIF DE TRAITEMENT LASER
(JA) レーザ加工方法およびレーザ加工装置
Abstract:
(EN) This laser processing method is a laser processing method for a laser processing device (1) provided with: a laser oscillator (2) which is a first laser oscillator for pulse oscillating a laser beam (L1), which is a first laser beam; and a laser oscillator (3) which is a second laser oscillator for pulse oscillating a laser beam (L2), which is a second laser beam having a wavelength or pulse width that differs from that of the first laser beam. In this laser processing method, a workpiece (15) is alternately irradiated by the first laser beam and the second laser beam.
(FR) L'invention concerne un procédé de traitement laser qui est un procédé de traitement laser pour un dispositif de traitement laser (1) ayant : un oscillateur laser (2) qui est un premier oscillateur laser pour l'oscillation d'impulsion d'un faisceau laser (L1), qui est un premier faisceau laser ; et un oscillateur laser (3) qui est un second oscillateur laser pour l'oscillation d'impulsion d'un faisceau laser (L2), qui est un second faisceau laser ayant une longueur d'onde ou une largeur d'impulsion qui diffère de celle du premier faisceau laser. Dans ce procédé de traitement laser, une pièce (15) est irradiée en alternance par le premier faisceau laser et le second faisceau laser.
(JA) レーザ加工方法は、第1のレーザビームであるレーザビーム(L1)をパルス発振する第1のレーザ発振器であるレーザ発振器(2)と、第1のレーザビームとは波長またはパルス幅が異なる第2のレーザビームであるレーザビーム(L2)をパルス発振する第2のレーザ発振器であるレーザ発振器(3)とを備えるレーザ加工装置(1)のレーザ加工方法である。レーザ加工方法において、第1のレーザビームと第2のレーザビームとを交互にワーク(15)に照射する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)