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1. (WO2019064193) HYBRID LAND GRID ARRAY CONNECTOR FOR IMPROVED SIGNAL INTEGRITY
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Pub. No.: WO/2019/064193 International Application No.: PCT/IB2018/057444
Publication Date: 04.04.2019 International Filing Date: 26.09.2018
IPC:
H01R 12/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
12
Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards (PCBs), flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
Applicants:
INTERNATIONAL BUSINESS MACHINES CORPORATION [US/US]; New Orchard Road Armonk, New York 10504, US
IBM UNITED KINGDOM LIMITED [GB/GB]; PO Box 41, North Harbour Portsmouth Hampshire PO6 3AU, GB (MG)
IBM (CHINA) INVESTMENT COMPANY LIMITED [CN/CN]; 25/F, Pangu Plaza No. 27, Central North 4th Ring Road, Chaoyang District Beijing 100101, CN (MG)
Inventors:
HEJASE, Jose, Ale; US
BECKER, Wiren; US
DREPS, Daniel; US
CHUN, Sungjun; US
BEAMAN, Brian; US
Agent:
FOURNIER, Kevin; GB
Priority Data:
15/717,97828.09.2017US
Title (EN) HYBRID LAND GRID ARRAY CONNECTOR FOR IMPROVED SIGNAL INTEGRITY
(FR) CONNECTEUR DE GRILLE MATRICIELLE TERRESTRE HYBRIDE POUR UNE INTÉGRITÉ DE SIGNAL AMÉLIORÉE
Abstract:
(EN) Embodiments of the present invention include a method for fabricating a hybrid land grid array connector and the resulting structures. A body is provided. The body includes a first plurality of holes and a second plurality of holes. A conductive layer is deposited on the top and bottom surfaces of the body and the wall surfaces of the first plurality of holes resulting in the top and bottom surfaces being electrically common. The conductive layer is removed from the wall surfaces of a first subset of the first plurality of holes. A portion of the conductive layer is removed from the top surface of the body and the bottom surface of the body from an area surrounding the first subset of the first plurality of holes.
(FR) Des modes de réalisation de la présente invention comprennent un procédé de fabrication d'un connecteur de grille matricielle terrestre hybride et les structures résultantes. Un corps est fourni. Le corps comprend une première pluralité de trous et une seconde pluralité de trous. Une couche conductrice est déposée sur les surfaces supérieure et inférieure du corps et les surfaces de paroi de la première pluralité de trous conduisant aux surfaces supérieure et inférieure sont électriquement communes. La couche conductrice est retirée des surfaces de paroi d'un premier sous-ensemble de la première pluralité de trous. Une partie de la couche conductrice est retirée de la surface supérieure du corps et de la surface inférieure du corps à partir d'une zone entourant le premier sous-ensemble de la première pluralité de trous.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)