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1. (WO2019063436) DEVICE COMPRISING LEADFRAMES, AND METHOD FOR PRODUCING A PLURALITY OF DEVICES
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Pub. No.: WO/2019/063436 International Application No.: PCT/EP2018/075648
Publication Date: 04.04.2019 International Filing Date: 21.09.2018
IPC:
H01L 25/075 (2006.01) ,H01L 33/54 (2010.01) ,H01L 33/62 (2010.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
075
the devices being of a type provided for in group H01L33/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
52
Encapsulations
54
having a particular shape
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
62
Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
Applicants:
OSRAM OPTO SEMICONDUCTORS GMBH [DE/DE]; Leibnizstr. 4 93055 Regensburg, DE
Inventors:
WINDISCH, Reiner; DE
BÖSL, Florian; DE
DOBNER, Andreas; DE
SPERL, Matthias; DE
Agent:
EPPING HERMANN FISCHER PATENTANWALTSGESELLSCHAFT MBH; Schloßschmidstr. 5 80639 München, DE
Priority Data:
10 2017 122 410.627.09.2017DE
Title (EN) DEVICE COMPRISING LEADFRAMES, AND METHOD FOR PRODUCING A PLURALITY OF DEVICES
(FR) DISPOSITIF COMPRENANT UN CADRE CONDUCTEUR ET PROCÉDÉ SERVANT À FABRIQUER UNE MULTITUDE DE DISPOSITIFS
(DE) VORRICHTUNG MIT LEITERRAHMEN UND VERFAHREN ZUR HERSTELLUNG EINER MEHRZAHL VON VORRICHTUNGEN
Abstract:
(EN) Disclosed is a device (1) comprising a leadframe (3), a moulded body (4) and a plurality of semiconductor chips (2) which are designed to produce radiation, wherein - the leadframe has two connection parts (31) for electrically contacting the device externally; - the moulded body is integrally formed on the leadframe; - the moulded body is permeable to the radiation which is produced during operation of the device; and - the semiconductor chips are arranged on a front side (41) of the moulded body and, in each case in a plan view of the device, overlap the moulded body. The invention further specifies a method for producing devices.
(FR) L'invention concerne un dispositif (1) comprenant un cadre conducteur (3), un corps moulé (4) et une multitude de puces électroconductrices (2), qui sont mises au point pour générer un rayonnement. Le cadre conducteur comporte deux parties de raccordement (31) servant à établir un contact électrique externe avec le dispositif. Le corps moulé est formé sur le cadre conducteur. Le corps moulé laisse passer le rayonnement généré lors du fonctionnement du dispositif. Les puces semi-conductrices sont disposées sur un côté avant (41) du corps moulé et chevauchent, respectivement dans une vue du dessus du dispositif, le corps moulé. L’invention concerne par ailleurs un procédé servant à fabriquer des dispositifs.
(DE) Es wird eine Vorrichtung (1) mit einem Leiterrahmen (3), einem Formkörper (4) und einer Mehrzahl von Halbleiterchips (2), die zur Erzeugung von Strahlung eingerichtet sind, angegeben, wobei - der Leiterrahmen zwei Anschlussteile (31) zur externen elektrischen Kontaktierung der Vorrichtung aufweist; - der Formkörper an den Leiterrahmen angeformt ist; - der Formkörper für die im Betrieb der Vorrichtung erzeugte Strahlung durchlässig ist; und - die Halbleiterchips auf einer Vorderseite (41) des Formkörpers angeordnet sind und jeweils in Draufsicht auf die Vorrichtung mit dem Formkörper überlappen. Weiterhin wird ein Verfahren zur Herstellung von Vorrichtungen angegeben.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: German (DE)
Filing Language: German (DE)