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1. (WO2019063115) BUMP BONDED CRYOGENIC CHIP CARRIER
Latest bibliographic data on file with the International BureauSubmit observation

Pub. No.: WO/2019/063115 International Application No.: PCT/EP2017/081722
Publication Date: 04.04.2019 International Filing Date: 06.12.2017
IPC:
H01L 23/498 (2006.01) ,H01L 23/00 (2006.01) ,H01L 27/18 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488
consisting of soldered or bonded constructions
498
Leads on insulating substrates
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
18
including components exhibiting superconductivity
Applicants:
INTERNATIONAL BUSINESS MACHINES CORPORATION [US/US]; New Orchard Road Armonk, New York 10504, US
IBM UNITED KINGDOM LIMITED [GB/GB]; PO Box 41, North Harbour Portsmouth Hampshire PO6 3AU, GB (MG)
Inventors:
ABRAHAM, David; US
COTTE, John, Michael; US
ROTHWELL, Mary, Beth; US
Agent:
LITHERLAND, David; GB
Priority Data:
15/721,08729.09.2017US
Title (EN) BUMP BONDED CRYOGENIC CHIP CARRIER
(FR) PORTE-PUCE CRYOGÉNIQUE SOUDÉ PAR BOSSES
Abstract:
(EN) A device comprises first thin films characterized by having a first opposing surface and a first connection surface in which the first connection surface is in physical contact with a first superconducting region. Second thin films are characterized by having a second opposing surface and a second connection surface in which the first and second opposing surfaces are opposite one another. The second connection surface is in physical contact with a second superconducting region. A solder material electrically connects the first and second opposing surfaces, and the solder material is characterized by maintaining a low ohmic electrical contact between the first and second opposing surfaces at temperatures below 100 degrees Kelvin. The first and second superconducting regions are formed of materials that have a melting point of at least 700 degrees Celsius.
(FR) La présente invention concerne un dispositif qui comprend des premiers films minces caractérisés en ce qu'ils présentent une première surface opposée et une première surface de connexion, la première surface de connexion étant en contact physique avec une première région supraconductrice. Des seconds films minces sont caractérisés en ce qu'ils présentent une seconde surface opposée et une seconde surface de connexion, les première et seconde surfaces opposées étant opposées l'une à l'autre. La seconde surface de connexion est en contact physique avec une seconde région supraconductrice. Un matériau de soudure connecte électriquement les première et seconde surfaces opposées, et le matériau de soudure est caractérisé par le maintien d'un contact électrique ohmique faible entre les première et seconde surfaces opposées à des températures inférieures à 100 degrés Kelvin. Les première et seconde régions supraconductrices sont constituées de matériaux qui ont un point de fusion d'au moins 700 degrés Celsius.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)