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1. (WO2019063061) MATERIAL DEPOSITION ARRANGEMENT, VACUUM DEPOSITION SYSTEM AND METHODS THEREFOR
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CLAIMS

A material deposition arrangement (100) for depositing material on a substrate in a vacuum deposition chamber, comprising:

a first deposition source (105) having one or more first openings (126); a second deposition source (105) having one or more second openings (126); and

a shutter arrangement having at least a first shutter (210) configured to be movable by an angle to the one or more first openings or the one or more second openings.

The material deposition arrangement (100) according to claim 1, wherein the at least first shutter is rotatable around an axis (211).

The material deposition arrangement (100) according to claim 1 or 2, further comprising:

a third deposition source (105) having one or more third openings (126), the shutter arrangement further comprising:

a second shutter movable by an angle to the one or more second openings; to the one or more third openings; and to a second park position.

A material deposition arrangement (100) for depositing a material on a substrate in a vacuum deposition chamber, comprising:

a first deposition source (105) having one or more first openings (126); a second deposition source (105) having one or more second openings

(126);

a first shutter (210); and

an actuator to move the first shutter by an angle in front of the one or more first openings or in front of the one or more second openings.

5. The material deposition arrangement (100) according to any of claims 1 to 4, the shutter moves by an angle to the one or more first openings, to the one or more second openings or to a first park position.

6. The material deposition arrangement (100) according to any of claims 1 to 5, further comprising:

a shaper shield device.

7. The material deposition arrangement (100) according to claim 6, wherein at least the first shutter is mounted to the shaper shield device.

8. The material deposition arrangement (100) according to claim 7, wherein at least the first shutter is mounted to at least a top portion of the shaper shield device.

9. The material deposition arrangement (100) according to any of claims 6 to 8, wherein the shaper shield device is connected to a cooling shield.

10. The material deposition arrangement (100) according to any of claims 6 to 9, the shaper shield device further comprising a side portion and an additional wall forming an enclosure to define a park position.

11. The material deposition arrangement (100) according to any of claims 6 to 8, the shaper shield device further comprising a side portion and an additional wall forming an enclosure to define a park position, wherein the shaper shield device is connected to a cooling shield and the side portion and the additional wall are passively cooled by the cooling shield.

12. The material deposition arrangement (100) according to any of claims 1 to 11, wherein at least the first deposition source is a line source having a plurality of openings extending along a line, and wherein at least the first shutter movable by the angle to be positioned in front of the plurality of openings.

A vacuum deposition system (100), comprising:

a vacuum deposition chamber; and

a material deposition arrangement (100) according to any of claims 1 to

11 in the vacuum deposition chamber.

14. The vacuum deposition system according to claim 13, further comprising a substrate carrier support for supporting a substrate in an essentially vertically orientation.

15. The vacuum deposition system according to any of claims 13 to 14, wherein the material deposition arrangement comprises a support for translational movement of the material deposition arrangement while levitated.

16. A method for conditioning a material deposition arrangement having at least a first deposition source and a second deposition source, comprising.

blocking materials at the first deposition source with a shutter; conditioning the second deposition source;

moving the shutter by an angle to the second deposition source;

blocking material at the second deposition source;

conditioning the second deposition source;

moving the shutter by an angle; and

depositing a material layer on a substrate by co-evaporation of the first deposition source and the second deposition source.