Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2019062727) METHOD AND DEVICE FOR CALCULATING EQUIVALENT MECHANICAL PARAMETERS OF FILM LAYER ETCHING REGION
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2019/062727 International Application No.: PCT/CN2018/107412
Publication Date: 04.04.2019 International Filing Date: 25.09.2018
IPC:
G06F 17/50 (2006.01) ,H01L 21/762 (2006.01)
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
F
ELECTRIC DIGITAL DATA PROCESSING
17
Digital computing or data processing equipment or methods, specially adapted for specific functions
50
Computer-aided design
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70
Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereof; Manufacture of integrated circuit devices or of specific parts thereof
71
Manufacture of specific parts of devices defined in group H01L21/7086
76
Making of isolation regions between components
762
Dielectric regions
Applicants:
京东方科技集团股份有限公司 BOE TECHNOLOGY GROUP CO., LTD. [CN/CN]; 中国北京市 朝阳区酒仙桥路10号 No.10 Jiuxianqiao Rd., Chaoyang District Beijing 100015, CN
鄂尔多斯市源盛光电有限责任公司 ORDOS YUANSHENG OPTOELECTRONICS CO., LTD. [CN/CN]; 中国内蒙古自治区鄂尔多斯市 东胜区鄂尔多斯装备制造基地 Ordos Equipment Manufacturing Base, Dongsheng District Ordos, Inner Mongolia 017020, CN
Inventors:
黄俊杰 HUANG, Chunchieh; CN
王琦 WANG, Qi; CN
张健 ZHANG, Jian; CN
吕守华 LV, Shouhua; CN
杨成发 YANG, Chengfa; CN
周猛 ZHOU, Meng; CN
Agent:
北京中博世达专利商标代理有限公司 BEIJING ZBSD PATENT & TRADEMARK AGENT LTD.; 中国北京市 海淀区交大东路31号11号楼8层 8F, Building 11 No. 31 Jiaoda East Road, Haidian District Beijing 100044, CN
Priority Data:
201710883448.626.09.2017CN
Title (EN) METHOD AND DEVICE FOR CALCULATING EQUIVALENT MECHANICAL PARAMETERS OF FILM LAYER ETCHING REGION
(FR) PROCÉDÉ ET DISPOSITIF DE CALCUL DE PARAMÈTRES MÉCANIQUES ÉQUIVALENTS D'UNE RÉGION DE GRAVURE DE COUCHE DE FILM
(ZH) 膜层刻蚀区域等效力学参数的计算方法和设备
Abstract:
(EN) The present disclosure provides a method for calculating equivalent mechanical parameters of a film layer etching region, the method comprising: selecting at least a part of the film layer etching region as an analysis region; establishing a planar model corresponding to the analysis region; performing grid division on the planar model at a first density; according to the actual mechanical parameters of film layer material and the grid division of the first density, analyzing, by means of a finite element method, a first simulation stress of the planar model in simulated boundary conditions; and calculating equivalent mechanical parameters, under the simulated boundary conditions, the equivalent mechanical parameters enabling an anisotropic planar blanking panel having the same size as that of the boundary of the planar model to reach the first simulated stress.
(FR) La présente invention concerne un procédé de calcul de paramètres mécaniques équivalents d'une région de gravure de couche de film, le procédé consistant à : sélectionner au moins une partie de la région de gravure de couche de film en tant que région d'analyse; établir un modèle plan correspondant à la région d'analyse; réaliser une division de grille sur le modèle plan à une première densité; en fonction des paramètres mécaniques réels du matériau de couche de film et de la division de grille de la première densité, analyser, au moyen d'un procédé à éléments finis, une première contrainte de simulation du modèle plan dans des conditions limites simulées; et calculer des paramètres mécaniques équivalents, dans les conditions limites simulées, les paramètres mécaniques équivalents permettant à un panneau de découpage plan anisotrope ayant la même taille que celui de la limite du modèle plan d'atteindre la première contrainte simulée.
(ZH) 本公开提供一种膜层刻蚀区域等效力学参数的计算方法,其包括:选取膜层刻蚀区域的至少一部分为分析区域;建立与分析区域对应的平面模型;以第一密度对平面模型进行网格划分;根据膜层材料的实际力学参数和第一密度的网格划分,通过有限元法分析平面模型在模拟边界条件下的第一模拟应力;计算等效力学参数,其中,在模拟边界条件下,等效力学参数能使与平面模型边界尺寸相同的各向异性的平面盲板达到第一模拟应力。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)