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1. WO2019062609 - CAMERA MODULE, PHOTOSENSITIVE COMPONENT, PHOTOSENSITIVE-COMPONENT JOINED PANEL, AND FORMING DIE THEREOF AND MANUFACTURING METHOD THEREOF

Publication Number WO/2019/062609
Publication Date 04.04.2019
International Application No. PCT/CN2018/106351
International Filing Date 19.09.2018
IPC
H04N 5/225 2006.1
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
NPICTORIAL COMMUNICATION, e.g. TELEVISION
5Details of television systems
222Studio circuitry; Studio devices; Studio equipment
225Television cameras
CPC
H01L 27/1461
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144Devices controlled by radiation
146Imager structures
14601Structural or functional details thereof
14609Pixel-elements with integrated switching, control, storage or amplification elements
1461characterised by the photosensitive area
H01L 27/14618
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144Devices controlled by radiation
146Imager structures
14601Structural or functional details thereof
14618Containers
H01L 27/14623
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144Devices controlled by radiation
146Imager structures
14601Structural or functional details thereof
1462Coatings
14623Optical shielding
H01L 27/14625
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144Devices controlled by radiation
146Imager structures
14601Structural or functional details thereof
14625Optical elements or arrangements associated with the device
H04N 5/2253
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
NPICTORIAL COMMUNICATION, e.g. TELEVISION
5Details of television systems
222Studio circuitry; Studio devices; Studio equipment ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, TV cameras, video cameras, camcorders, webcams, camera modules for embedding in other devices, e.g. mobile phones, computers or vehicles
225Television cameras ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, camcorders, webcams, camera modules specially adapted for being embedded in other devices, e.g. mobile phones, computers or vehicles
2251Constructional details
2253Mounting of pick-up device, electronic image sensor, deviation or focusing coils
H04N 5/2254
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
NPICTORIAL COMMUNICATION, e.g. TELEVISION
5Details of television systems
222Studio circuitry; Studio devices; Studio equipment ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, TV cameras, video cameras, camcorders, webcams, camera modules for embedding in other devices, e.g. mobile phones, computers or vehicles
225Television cameras ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, camcorders, webcams, camera modules specially adapted for being embedded in other devices, e.g. mobile phones, computers or vehicles
2251Constructional details
2254Mounting of optical parts, e.g. lenses, shutters, filters or optical parts peculiar to the presence or use of an electronic image sensor
Applicants
  • 宁波舜宇光电信息有限公司 NINGBO SUNNY OPOTECH CO., LTD. [CN]/[CN]
Inventors
  • 田中武彦 TANAKA, Takehiko
  • 赵波杰 ZHAO, Bojie
  • 梅哲文 MEI, Zhewen
  • 郭楠 GUO, Nan
Agents
  • 宁波理文知识产权代理事务所(特殊普通合伙) NINGBO RAYMOND IP AGENCY FIRM
Priority Data
201710895910.428.09.2017CN
201721262500.828.09.2017CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) CAMERA MODULE, PHOTOSENSITIVE COMPONENT, PHOTOSENSITIVE-COMPONENT JOINED PANEL, AND FORMING DIE THEREOF AND MANUFACTURING METHOD THEREOF
(FR) MODULE DE CAMÉRA, COMPOSANT PHOTOSENSIBLE, PANNEAU ASSEMBLÉ À COMPOSANT PHOTOSENSIBLE, ET SA PUCE DE FORMATION ET SON PROCÉDÉ DE FABRICATION
(ZH) 摄像模组、感光组件、感光组件拼板及其成型模具和制造方法
Abstract
(EN)
Provided is a camera module and photosensitive component thereof and manufacturing method thereof, said photosensitive component comprising: a circuit board, a photosensitive element, and a molding base; the molding base is integrally formed on the circuit board and photosensitive element to form a light window; a first end side corresponding to the flexible region adjacent to the molding base has a first side surface facing the light window; said first side surface comprises a first partial surface arranged adjacent to the photosensitive element and a second partial surface connected to said first partial surface; a first angle between said first partial surface and the optical axis of the camera module is greater than a second angle between the second partial surface and the optical axis; a second end side opposite to and away from the flexible region of the molding base has a second side surface facing the light window; said second side surface comprises a third partial surface arranged adjacent to the photosensitive element and a fourth partial surface connected to said third partial surface; a third angle between the third partial surface and the optical axis is greater than a fourth angle between the fourth partial surface and the optical axis.
(FR)
L'invention concerne un module de caméra et son composant photosensible et son procédé de fabrication, ledit composant photosensible comprenant : une carte de circuit imprimé, un élément photosensible et une base de moulage; la base de moulage est formée d'un seul tenant sur la carte de circuit imprimé et l'élément photosensible afin de former une fenêtre de lumière; un premier côté d'extrémité correspondant à la région flexible adjacente à la base de moulage présente une première surface latérale faisant face à la fenêtre de lumière; ladite première surface latérale comprend une première surface partielle agencée adjacente à l'élément photosensible et une seconde surface partielle reliée à ladite première surface partielle; un premier angle entre ladite première surface partielle et l'axe optique du module de caméra est supérieur à un second angle entre la seconde surface partielle et l'axe optique; un second côté d'extrémité opposé à la région flexible de la base de moulage et à l'opposé de celle-ci présentant une seconde surface latérale faisant face à la fenêtre de lumière; ladite seconde surface latérale comprenant une troisième surface partielle agencée adjacente à l'élément photosensible et une quatrième surface partielle reliée à ladite troisième surface partielle; un troisième angle entre la troisième surface partielle et l'axe optique est supérieur à un quatrième angle entre la quatrième surface partielle et l'axe optique.
(ZH)
一摄像模组及其感光组件和制造方法,该感光组件包括:电路板,感光元件以及模塑基座,其中模塑基座一体地成型于电路板和感光元件并形成光窗;其中对应于模塑基座邻近柔性区域的第一端侧具有朝向光窗的第一侧表面,所述第一侧表面包括邻近感光元件设置的第一部分表面和与第一部分表面相连接的第二部分表面,且所述第一部分表面相对于摄像模组的光轴的第一角度大于第二部分表面相对于光轴的第二角度;对应于模塑基座远离柔性区域的相反的第二端侧具有朝向光窗的第二侧表面,第二侧表面包括邻近感光元件设置的第三部分表面和与第三部分表面相连接的第四部分表面,且所述第三部分表面相对于光轴的第三角度大于第四部分表面相对于光轴的第四角度。
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