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1. (WO2019062477) HOUSING MANUFACTURING METHOD, HOUSING, AND ELECTRONIC DEVICE
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Pub. No.: WO/2019/062477 International Application No.: PCT/CN2018/103659
Publication Date: 04.04.2019 International Filing Date: 31.08.2018
IPC:
H05K 5/02 (2006.01) ,H01Q 1/22 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
5
Casings, cabinets or drawers for electric apparatus
02
Details
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
1
Details of, or arrangements associated with, aerials
12
Supports; Mounting means
22
by structural association with other equipment or articles
Applicants:
OPPO广东移动通信有限公司 GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD. [CN/CN]; 中国广东省东莞市 长安镇乌沙海滨路18号 No.18, Haibin Road, Wusha, Chang'an Dongguan, Guangdong 523860, CN
Inventors:
唐义梅 TANG, Yimei; CN
周新权 ZHOU, Xinquan; CN
孙毅 SUN, Yi; CN
胡海金 HU, Haijin; CN
王聪 WANG, Cong; CN
蒙海滨 MENG, Haibin; CN
陈仕权 CHEN, Shiquan; CN
谷一平 GU, Yiping; CN
Agent:
广州三环专利商标代理有限公司 SCIHEAD IP LAW FIRM; 中国广东省广州市 越秀区先烈中路80号汇华商贸大厦1508室 Room 1508, Huihua Commercial & Trade Building No.80, Xianlie Zhong Road, Yuexiu District Guangzhou, Guangdong 510070, CN
Priority Data:
201710928353.130.09.2017CN
Title (EN) HOUSING MANUFACTURING METHOD, HOUSING, AND ELECTRONIC DEVICE
(FR) PROCÉDÉ DE FABRICATION DE BOÎTIER, BOÎTIER ET DISPOSITIF ÉLECTRONIQUE
(ZH) 一种壳体制作方法、壳体及电子设备
Abstract:
(EN) Provided in the present application are a housing manufacturing method, a housing, and an electronic device, the housing manufacturing method comprising: providing a housing body, the housing body having a first surface, a second surface opposite the first surface, an inner cavity extending from the first surface towards the second surface, and an antenna slot penetrating the inner cavity from the second surface; filling the antenna slot with a non-signal shielding material; and machining the second surface into a rear curved surface. First filling the antenna slot with a non-signal shielding material and then machining the second surface to shape the outer surface appearance ensures the shaping quality of their outer surface appearance and increases housing manufacturing efficiency.
(FR) La présente invention concerne un procédé de fabrication de boîtier, un boîtier et un dispositif électronique, le procédé de fabrication de boîtier consistant à : fournir un corps de boîtier, le corps de boîtier ayant une première surface, une seconde surface opposée à la première surface, une cavité interne s'étendant de la première surface vers la seconde surface, et une fente d'antenne pénétrant dans la cavité interne à partir de la seconde surface ; remplir la fente d'antenne avec un matériau de protection sans signal ; et usiner la seconde surface en une surface incurvée arrière. Le remplissage en premier lieu de la fente d'antenne avec un matériau de protection sans signal, puis l'usinage de la seconde surface pour former l'aspect de surface externe garantit la qualité de mise en forme de leur aspect de surface externe et augmente l'efficacité de fabrication de boîtier.
(ZH) 本申请提供了一种壳体制作方法、壳体及电子设备,所述壳体制作方法包括:提供壳体基体,所述壳体基体具有第一表面、相对所述第一表面设置的第二表面和由所述第一表面朝所述第二表面延伸的内腔,以及由所述第二表面贯穿至所述内腔的天线槽;向所述天线槽内填充非信号屏蔽材料;将所述第二表面加工成背部曲面。通过先向所述天线槽内填充非信号屏蔽材料,然后对所述第二表面加工,以成型出外观面,保证了外观面的成型质量,提高了壳体制作效率。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)