Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2019062311) HEAT DISSIPATION MEMBER FOR CIRCUIT BOARD, AND DISPLAY PANEL USING SAME
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2019/062311 International Application No.: PCT/CN2018/097221
Publication Date: 04.04.2019 International Filing Date: 26.07.2018
IPC:
H01L 23/427 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
42
Fillings or auxiliary members in containers selected or arranged to facilitate heating or cooling
427
Cooling by change of state, e.g. use of heat pipes
Applicants:
京东方科技集团股份有限公司 BOE TECHNOLOGY GROUP CO., LTD. [CN/CN]; 中国北京市 朝阳区酒仙桥路10号 No. 10 Jiuxianqiao Rd., Chaoyang District Beijing 100015, CN
北京京东方显示技术有限公司 BEIJING BOE DISPLAY TECHNOLOGY CO., LTD. [CN/CN]; 中国北京市 北京经济技术开发区经海一路118号 No. 118 Jinghaiyilu, BDA Beijing 100176, CN
Inventors:
张宁 ZHANG, Ning; CN
孙志华 SUN, Zhihua; CN
姚树林 YAO, Shulin; CN
苏国火 SU, Guohuo; CN
唐继托 TANG, Jituo; CN
Agent:
中科专利商标代理有限责任公司 CHINA SCIENCE PATENT & TRADEMARK AGENT LTD.; 中国北京市 海淀区西三环北路87号4-1105室 Suite 4-1105, No. 87, West 3rd Ring North Rd. Haidian District Beijing 100089, CN
Priority Data:
201710917675.630.09.2017CN
Title (EN) HEAT DISSIPATION MEMBER FOR CIRCUIT BOARD, AND DISPLAY PANEL USING SAME
(FR) ÉLÉMENT DE DISSIPATION DE CHALEUR POUR CARTE DE CIRCUIT IMPRIMÉ, ET PANNEAU D'AFFICHAGE L'UTILISANT
(ZH) 用于电路板的散热件以及应用该散热件的显示面板
Abstract:
(EN) In an embodiment, a heat dissipation member for a circuit board comprises a main body. The main body of the heat dissipation member comprises a first substrate and a second substrate. The first substrate and the second substrate fit to and seal each other to define multiple heat dissipation cavities arranged at intervals. The heat dissipation cavity is used to accommodate a working substance. Each of the multiple heat dissipation cavities is in communication with at least one of the remaining heat dissipation cavities by means of a circulation channel. Each of the multiple heat dissipation cavities has a condensation part and an evaporation part, thereby realizing an evaporation-condensation cycle of the working substance between the condensation part and the evaporation part.
(FR) Dans un mode de réalisation de la présente invention, un élément de dissipation de chaleur pour une carte de circuit imprimé comprend un corps principal. Le corps principal de l'élément de dissipation de chaleur comprend un premier substrat et un second substrat. Le premier substrat et le second substrat s'adaptent l'un à l'autre et se ferment mutuellement pour définir de multiples cavités de dissipation de chaleur agencées par intervalles. La cavité de dissipation de chaleur est utilisée pour recevoir une substance de travail. Chacune des multiples cavités de dissipation de chaleur est en communication avec au moins une des cavités de dissipation de chaleur restantes au moyen d'un canal de circulation. Chacune des multiples cavités de dissipation de chaleur comporte une partie de condensation et une partie d'évaporation, réalisant ainsi un cycle d'évaporation-condensation de la substance de travail entre la partie de condensation et la partie d'évaporation
(ZH) 在一个实施例中,一种用于电路板的散热件,包括散热件本体。散热件本体包括第一基板和第二基板,第一基板和第二基板彼此密封配合以限定多个间隔分布的散热腔室,散热腔室用于容纳工质,多个散热腔室中的每个均与其余散热腔室中的至少一个通过流通通道相连通,多个散热腔室中的每个均具有冷凝部位和蒸发部位以使得工质能够在冷凝部位和蒸发部位之间实现蒸发-冷凝循环。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)