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1. (WO2019061963) CUTTING METHOD EMPLOYING LASER
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Pub. No.: WO/2019/061963 International Application No.: PCT/CN2018/073501
Publication Date: 04.04.2019 International Filing Date: 19.01.2018
IPC:
B23K 26/06 (2014.01) ,B23K 26/38 (2014.01)
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
02
Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
06
Shaping the laser beam, e.g. by masks or multi-focusing
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
36
Removing material
38
by boring or cutting
Applicants:
武汉华星光电半导体显示技术有限公司 WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. [CN/CN]; 中国湖北省武汉市 东湖新技术开发区高新大道666号光谷生物创新园C5栋305室 305 Room, Building C5, Biolake of Optics Valley No.666 Gaoxin Avenue, Wuhan East Lake High-Tech Development Zone Wuhan, Hubei 430070, CN
Inventors:
袁朝煜 YUAN, Chaoyu; CN
Agent:
广州三环专利商标代理有限公司 SCIHEAD IP LAW FIRM; 中国广东省广州市 越秀区先烈中路80号汇华商贸大厦1508室 Room 1508, Huihua Commercial & Trade Building No. 80, Xianlie Zhong Road, Yuexiu District Guangzhou, Guangdong 510070, CN
Priority Data:
201710887572.X26.09.2017CN
Title (EN) CUTTING METHOD EMPLOYING LASER
(FR) PROCÉDÉ DE DÉCOUPE FAISANT APPEL À UN LASER
(ZH) 激光切割方法
Abstract:
(EN) A cutting method employing a laser (11). Before a laser (11) has been used to perform a cutting operation, a heat absorption layer (20) is laid over a cutting path on a substrate to undergo a cutting operation, such that when the laser (11) cuts the substrate (10) along the cutting path on the substrate (10), the heat absorption layer (20) can partially absorb heat of the laser (11), thereby reducing a temperature gradient between a cut section and a non-cut section surrounding the cut section on the substrate (10) during cutting, reducing generation of heat stress and formation of defects, such as cracks, and providing a product of good quality.
(FR) L'invention concerne un procédé de découpe faisant appel à un laser (11). Avant qu'un laser (11) ne soit utilisé pour effectuer une opération de découpe, une couche d'absorption de chaleur (20) est déposée sur un trajet de découpe sur un substrat pour qu'il subisse une opération de découpe, de sorte que, lorsque le laser (11) découpe le substrat (10) le long du trajet de découpe sur le substrat (10), la couche d'absorption de chaleur (20) puisse absorber partiellement la chaleur du laser (11), ce qui permet de réduire un gradient de température entre une section découpée et une section non découpée entourant la section découpée sur le substrat (10) pendant la découpe, de réduire la génération d'une contrainte thermique et la formation de défauts, tels que des fissures, et de fournir un produit de qualité satisfaisante.
(ZH) 一种激光(11)切割方法,通过在进行激光(11)切割前,在待切割基板(10)的切割轨迹上覆盖吸热层(20),使得激光(11)沿所述待切割基板(10)的切割轨迹切割所述待切割基板(10)时,所述吸热层(20)能够部分吸收所述激光(11)的热能,从而减小切割时在所述待切割基板(10)上切割位置与其周围的非切割位置的温度梯度的大小,减少热应力的产生,进而减少裂纹等缺陷的产生,得到品质较佳的产品。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)