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1. (WO2019061408) CARD HOLDER STRUCTURE AND MOBILE PHONE
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Pub. No.: WO/2019/061408 International Application No.: PCT/CN2017/104799
Publication Date: 04.04.2019 International Filing Date: 30.09.2017
IPC:
H04M 1/02 (2006.01) ,H01R 12/71 (2011.01) ,H01R 13/24 (2006.01) ,H01R 13/648 (2006.01)
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
M
TELEPHONIC COMMUNICATION
1
Substation equipment, e.g. for use by subscribers
02
Constructional features of telephone sets
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
12
Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards (PCBs), flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
70
Coupling devices
71
for rigid printing circuits or like structures
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
13
Details of coupling devices of the kinds covered by groups H01R12/7087
02
Contact members
22
Contacts for co-operating by abutting
24
resilient; resiliently mounted
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
13
Details of coupling devices of the kinds covered by groups H01R12/7087
648
Protective earth or shield arrangements on coupling devices
Applicants:
深圳传音制造有限公司 SHENZHEN TRANSSION MANUFACTURE LIMITED [CN/CN]; 中国广东省深圳市 南山区粤海街道深圳湾科技生态园9栋B座16层01-07号房 Rooms 01-07, 16/F, Unit B Building No. 9, Shenzhen Bay Eco-Technology Park, Yuehai Street, Nanshan District Shenzhen City, Guangdong 518000, CN
Inventors:
孟跃龙 MENG, Yuelong; CN
鞠伟光 JU, Weiguang; CN
Agent:
北京同立钧成知识产权代理有限公司 LEADER PATENT & TRADEMARK FIRM; 中国北京市 海淀区西直门北大街32号枫蓝国际A座8F-6 8F-6,Bldg.A,Winland International Center NO.32 Xizhimen North Street,Haidian District Beijing 100082, CN
Priority Data:
Title (EN) CARD HOLDER STRUCTURE AND MOBILE PHONE
(FR) STRUCTURE DE SUPPORT DE CARTE ET TÉLÉPHONE MOBILE
(ZH) 卡座结构及手机
Abstract:
(EN) Provided by the present invention are a card holder structure and a mobile phone. The card holder structure comprises: a card holder body, a metal spring foot, a shielding cover and an electronic component; the card holder body and the metal spring foot are both arranged on a motherboard, wherein the metal spring foot is arranged on the outer side of the card holder body; the bottom of the shielding cover is arranged on the motherboard, and a shielding cavity is formed between the shielding cover and the motherboard, the card holder body and the metal spring foot both being located in the shielding cavity; the top of the shielding cover is provided with a hole for the spring foot to extend out, and when the metal spring foot is in a free state, the metal spring foot extends out of the top of the shield cover by means of the hole for the spring foot to extend out; when the electronic component is arranged at the top of the shielding cover, the metal spring foot is in contact with a contact point on the electronic component. When the electronic component is arranged at the top of the card holder, a direct connection between the electronic component and the motherboard is achieved by direct contact connection between the contact point on the electronic component and the metal spring foot arranged in the shielding cover, thus making the layout structure more compact and significantly reducing costs.
(FR) L'invention concerne une structure de support de carte et un téléphone mobile. La structure de support de carte comprend : un corps de support de carte, un pied de ressort métallique, un couvercle de protection et un composant électronique; le corps de support de carte et le pied de ressort métallique sont tous deux disposés sur une carte mère, le pied de ressort métallique étant disposé sur le côté extérieur du corps de support de carte; le fond du couvercle de blindage est disposé sur la carte mère, et une cavité de blindage est formée entre le couvercle de blindage et la carte mère, le corps de support de carte et le pied de ressort métallique étant tous deux situés dans la cavité de protection; la partie supérieure du couvercle de protection est pourvue d'un trou pour que le pied de ressort s'étende vers l'extérieur, et lorsque le pied de ressort métallique est dans un état libre, le pied de ressort métallique s'étend hors de la partie supérieure du couvercle de protection au moyen du trou pour que le pied de ressort s'étende vers l'extérieur; lorsque le composant électronique est disposé au sommet du couvercle de blindage, le pied de ressort métallique est en contact avec un point de contact sur le composant électronique. Lorsque le composant électronique est disposé au sommet du support de carte, une connexion directe entre le composant électronique et la carte mère est obtenue par une connexion de contact direct entre le point de contact sur le composant électronique et le pied de ressort métallique disposé dans le couvercle de blindage, rendant ainsi la structure de disposition plus compacte et réduisant significativement les coûts.
(ZH) 本发明提供一种卡座结构及手机。其中,所述的卡座结构,包括:卡座本体、金属弹脚、屏蔽罩以及电子组件;卡座本体和金属弹脚均设置在主板上,其中,金属弹脚设置在卡座本体的外侧;屏蔽罩底部设置在主板上,屏蔽罩与主板之间形成屏蔽腔,其中,卡座本体和金属弹脚均位于屏蔽腔内;屏蔽罩的顶部开设有弹脚伸出孔,当金属弹脚处于自由状态时,金属弹脚通过弹脚伸出孔伸出屏蔽罩的顶部;当电子组件设置在屏蔽罩顶部时,金属弹脚与电子组件上的触点相接触。在卡座顶部布置电子组件时,通过将电子组件上的触点和设置在屏蔽罩内的金属弹脚直接接触连接,实现电子组件与主板的直接导通,使得布置结构更加紧凑,同时也大大降低了成本。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)